Semicondctor device package thermal conduit
AssigneeTexas Instruments Incorporated
InventorsArchana Venugopal, Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering
Life of this patent
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Abstract
A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.
Claims25
A device comprising:
- an integrated circuit;
- a material covering at least part of the integrated circuit, the material including an opening that penetrates through the material;
- and
- a layer of nanoparticles on at least part of an internal wall of the opening and over at least part of the integrated circuit.
A device comprising:
- an integrated circuit including:
- a substrate that includes a first surface and a second surface opposite the first surface;
- and
- an interconnect structure on the first surface of the substrate;
- a layer of nanoparticles on the integrated circuit, the layer of nanoparticles including a bottom portion and two protruding top portions on two sides of the bottom portion, in which the bottom portion is conformal to and in direct contact with the interconnect structure or the second surface and is between the integrated circuit and the two protruding top portions.
Dependencies are inferred from the claim text.