Film forming method and article manufacturing method

A film forming method of forming a planarization film on a substrate using a superstrate having a flat surface, comprising:

• discretely arranging a curable composition (A) as a plurality of droplets on a substrate;
• waiting until the plurality of droplets arranged on the substrate in the arranging combine with each other on the substrate to form a liquid film;
• bringing the liquid film on the substrate and the flat surface of the superstrate into contact with each other after the waiting;
• heating and curing the liquid film after the bringing, thereby forming a cured film between the superstrate and the substrate;
• and
• releasing the superstrate from the cured film after the curing,
• wherein the curable composition (A) arranged on the substrate in the arranging is a thermosetting curable composition having a characteristic of being cured by heating, and contains at least a solvent (d),
• wherein a viscosity of the curable composition (A) at 23° C. is not less than 2 mPa·s and not more than 60 mPa·s,
• wherein a content of the solvent (d) in the curable composition (A) is not less than 5 vol % and not more than 95 vol %,
• wherein a boiling point of the solvent (d) at normal pressure is less than 250° C., and
• wherein a mixture other than the solvent (d) in the curable composition (A) has a viscosity of not less than 30 mPa·s and not more than 10,000 mPa·s at 23° C.