Thin film transistor and method of manufactruting thin film transistor

A thin film transistor, comprising:

• a flexible substrate having a support surface;
• a gate electrode layer located in a first part of the support surface of the flexible substrate;
• a gate insulating layer covering the gate electrode layer and a second part of the support surface of the flexible substrate;
• a semiconductor layer formed such that the semiconductor layer and the gate electrode layer are sandwiching the gate insulating layer;
• a protective layer formed such that the protective layer is covering the semiconductor layer and exposing first and second regions on an upper surface of the semiconductor layer;
• a source electrode layer formed such that the source electrode layer is in contact with the first region on the upper surface of the semiconductor layer;
• and
• a drain electrode layer formed such that the drain electrode layer is in contact with the second region on the upper surface of the semiconductor layer,
• wherein the protective layer comprises an organic polymer compound or an organic-inorganic composite material, the gate insulating layer includes a first gate insulating coating and a second gate insulating coating such that the first gate insulating coating comprises an organic polymer compound or an organic-inorganic composite material and is covering the second part and the gate electrode layer and that the second gate insulating coating comprises one compound selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide and is sandwiched between the first gate insulating coating and the semiconductor layer, the first gate insulating coating has a thickness in a range of 100 nm to 1500 nm and a product of the thickness and Young's modulus in a range of 300 nm·GPa to 30000 nm·GPa, and the second gate insulating coating has a thickness in a range of 2 nm to 30 nm and a product of the thickness and Young's modulus of the second gate insulating coating in a range of 100 nm·GPa to 9000 nm·GPa.

A thin film transistor, comprising:

• a flexible substrate having a support surface;
• a gate electrode layer located in a first part of the support surface of the flexible substrate;
• a gate insulating layer covering the gate electrode layer and a second part of the support surface of the flexible substrate;
• a semiconductor layer formed such that the semiconductor layer and the gate electrode layer are sandwiching the gate insulating layer;
• a protective layer formed such that the protective layer is covering the semiconductor layer and exposing first and second regions on an upper surface of the semiconductor layer;
• a source electrode layer formed such that the source electrode layer is in contact with the first region on the upper surface of the semiconductor layer;
• and
• a drain electrode layer formed such that the drain electrode layer is in contact with the second region on the upper surface of the semiconductor layer,
• wherein the protective layer comprises silicon oxide, silicon nitride or silicon oxynitride, the gate insulating layer includes a first gate insulating coating and a second gate insulating coating such that the first gate insulating coating comprises an organic polymer compound or an organic-inorganic composite material and is covering the second part and the gate electrode layer and that the second gate insulating coating comprises one compound selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide and is sandwiched between the first gate insulating coating and the semiconductor layer, the first gate insulating coating has a thickness in a range of 100 nm to 1500 nm and a product of the thickness and Young's modulus in a range of 300 nm·GPa to 30000 nm·GPa, and the second gate insulating coating has a thickness in a range of 2 nm to 30 nm and a product of the thickness and Young's modulus of the second gate insulating coating in a range of 100 nm·GPa to 9000 nm·GPa.

A method of manufacturing a thin film transistor, comprising:

• forming a gate electrode layer on a first part of a support surface of a flexible substrate;
• forming a gate insulating layer covering the gate electrode layer and a second part of the support surface of the flexible substrate;
• forming a semiconductor layer such that the semiconductor layer and the gate electrode layer are sandwiching the gate insulating layer;
• forming a source electrode layer such that the source electrode layer is in contact with a first end of the semiconductor layer and no insulating layer is formed between the source electrode layer and the semiconductor layer;
• and
• forming a drain electrode layer such that the drain electrode layer is in contact with a second end of the semiconductor layer and that no insulating layer is formed between the drain electrode layer and the semiconductor layer,
• wherein the forming of the gate insulating layer includes forming, by a coating method, a first gate insulating coating comprising an organic polymer compound or an organic-inorganic composite material such that the first gate insulating coating covers the second part and the gate electrode layer, and forming a second gate insulating coating comprising one compound selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide such that the second gate insulating coating is sandwiched between the first gate insulating coating and the semiconductor layer, the first gate insulating coating is formed such that the first gate insulating coating has a thickness in a range of 100 nm to 1500 nm and a product of the thickness and Young's modulus of the first gate insulating coating is in a range of 300 nm·GPa to 30000 nm·GPa, and the second gate insulating coating is formed such that the second gate insulating coating has a thickness in a range of 2 nm to 30 nm and a product of the thickness and Young's modulus of the second gate insulating coating is in a range of 100 nm·GPa to 9000 nm·GPa.

A method of manufacturing a thin film transistor, comprising:

• forming a gate electrode layer on a first part of a support surface of a flexible substrate;
• forming a gate insulating layer covering the gate electrode layer and a second part of the support surface of the flexible substrate;
• forming a semiconductor layer such that the semiconductor layer and the gate electrode layer are sandwiching the gate insulating layer;
• forming a protective layer comprising an organic polymer compound or an organic-inorganic composite material such that the protective layer exposes first and second regions on an upper surface of the semiconductor layer;
• and
• forming a source electrode layer such that the source electrode layer is in contact with the first region on the upper surface of the semiconductor layer;
• and
• forming a drain electrode layer such that the drain electrode layer is in contact with the second region on the upper surface of the semiconductor layer,
• wherein the forming of the gate insulating layer includes forming, by a coating method, a first gate insulating coating comprising an organic polymer compound or an organic-inorganic composite material such that the first gate insulating coating covers the second part and the gate electrode layer, and forming a second gate insulating coating comprising one compound selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide such that the second gate insulating coating is sandwiched between the first gate insulating coating and the semiconductor layer, the first gate insulating coating is formed such that the first gate insulating coating has a thickness in a range of 100 nm to 1500 nm and a product of the thickness and Young's modulus of the first gate insulating coating is in a range of 300 nm·GPa to 30000 nm·GPa, and the second gate insulating coating is formed such that the second gate insulating coating has a thickness in a range of 2 nm to 30 nm and a product of the thickness and Young's modulus of the second gate insulating coating is in a range of 100 nm·GPa to 9000 nm·GPa.