H10D 84/0149
Manufacturing their interconnections or electrodes
Official title: {Manufacturing their interconnections or electrodes, e.g. source or drain electrodes}
H10D84/0149 (Manufacturing their interconnections or electrodes) appears on 3,835 US grants and 5,352 published applications in this corpus.
Search patents in H10D- Granted patents
- 3,835
- Published applications
- 5,352
- Assignees
- 323
- Inventors
- 5,239
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 11 | 0 |
| 2001 | 18 | 7 |
| 2002 | 22 | 26 |
| 2003 | 23 | 23 |
| 2004 | 23 | 25 |
| 2005 | 23 | 31 |
| 2006 | 25 | 38 |
| 2007 | 15 | 46 |
| 2008 | 24 | 45 |
| 2009 | 20 | 47 |
| 2010 | 37 | 75 |
| 2011 | 45 | 47 |
| 2012 | 41 | 76 |
| 2013 | 75 | 83 |
| 2014 | 87 | 84 |
| 2015 | 100 | 139 |
| 2016 | 177 | 216 |
| 2017 | 240 | 263 |
| 2018 | 318 | 293 |
| 2019 | 279 | 285 |
| 2020 | 335 | 368 |
| 2021 | 262 | 344 |
| 2022 | 281 | 418 |
| 2023 | 292 | 546 |
| 2024 | 381 | 659 |
| 2025 | 368 | 711 |
| 2026 | 280 | 457 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Contact formation with staggered gate patterning6 Oct 2026US 12,757,441 B2International Business Machines Corporation
- Co-integration of S/D metal contact cut and wrap-around-contact6 Oct 2026US 12,757,445 B2International Business Machines Corporation
- Wrap around backside source/drain contact6 Oct 2026US 12,757,469 B2International Business Machines Corporation
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,481 B2Renesas Electronics Corporation
- Alignment mark for back side power connections6 Oct 2026US 12,757,704 B2International Business Machines Corporation
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0313980 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure with conductive contact8 Oct 2026US 2026/0313986 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and method for forming the same8 Oct 2026US 2026/0314001 A1National Taiwan University
- Integrated circuit device and manufacturing method thereof8 Oct 2026US 2026/0314007 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Self aligned contact scheme568US 9,548,366 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Wrap-around contact550US 9,443,769 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Self aligned contact scheme522US 9,859,386 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Method of manufacturing semiconductor local interconnect and contact198US 6,884,712 B2Chartered Semiconductor Manufacturing Ltd. · 2005
- Process for making integrated circuits having titanium nitride triple interconnect196US 4,804,636 ATexas Instruments Incorporated · 1989