404,498 results
- US 2026/0324523 A1Published 15 Oct 2026Semiconductor package including support wire
Samsung Electronics Co., Ltd.
- US 2026/0324515 A1Published 15 Oct 2026Three-dimensional semiconductor memory device with overlapping contacts, and electronic system including the same
Samsung Electronics Co., Ltd.
- US 2026/0324506 A1Published 15 Oct 2026
- US 2026/0324497 A1Published 15 Oct 2026Semiconductor package structure with stiffener mold and method of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324495 A1Published 15 Oct 2026Packaged module with improved integration density
Monolithic Power Systems, Inc.
- US 2026/0324493 A1Published 15 Oct 2026Semiconductor device and method of manufacturing semiconductor device
Mitsubishi Electric Corporation
- US 2026/0324472 A1Published 15 Oct 2026Semiconductor package including noise reducing structure
Samsung Electronics Co., Ltd.
- US 2026/0324467 A1Published 15 Oct 2026Electronic package structure and method for manufacturing the same
Advanced Semiconductor Engineering, Inc.
- US 2026/0324461 A1Published 15 Oct 2026
- US 2026/0324447 A1Published 15 Oct 2026Mark structure for nanostructure device and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324442 A1Published 15 Oct 2026
- US 2026/0324438 A1Published 15 Oct 2026Electrostatic discharge protection device
STMicroelectronics International N.V.
- US 2026/0324424 A1Published 15 Oct 2026Power module and method manufacturing of power module
Hyundai Motor Company
- US 2026/0324414 A1Published 15 Oct 2026Asymmetrical digital cells embedded with beol capacitors
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324413 A1Published 15 Oct 2026Semiconductor device and methods of formation
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324405 A1Published 15 Oct 2026Hybrid device with backside power delivery networks and associated systems and methods
Micron Technology, Inc.
- US 2026/0324404 A1Published 15 Oct 2026Interconnection line for semiconductor devices and semiconductor devices including same
Samsung Electronics Co., Ltd.
- US 2026/0324402 A1Published 15 Oct 2026Semiconductor device and methods of formation
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324401 A1Published 15 Oct 2026Semiconductor integrated circuit device
Socionext Inc.
- US 2026/0324399 A1Published 15 Oct 2026Memory device and method of manufacturing a memory device
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- US 2026/0324398 A1Published 15 Oct 2026Parallel backside via device, layout, and method
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324396 A1Published 15 Oct 2026Structure and method for transistors having backside power rails
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324394 A1Published 15 Oct 2026Semiconductor Device With Source/Drain Via
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324389 A1Published 15 Oct 2026Transistor gate contacts and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.