H05K 2201/09509
Blind vias, i.e. vias having one side closed
H05K2201/09509 (Blind vias, i.e. vias having one side closed) appears on 1,221 US grants and 1,301 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,221
- Published applications
- 1,301
- Assignees
- 415
- Inventors
- 2,545
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 5 | 0 |
| 1990 | 9 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 11 | 0 |
| 1994 | 10 | 0 |
| 1995 | 17 | 0 |
| 1996 | 19 | 0 |
| 1997 | 12 | 0 |
| 1998 | 13 | 0 |
| 1999 | 18 | 0 |
| 2000 | 22 | 0 |
| 2001 | 34 | 27 |
| 2002 | 54 | 52 |
| 2003 | 40 | 50 |
| 2004 | 50 | 65 |
| 2005 | 41 | 68 |
| 2006 | 42 | 92 |
| 2007 | 47 | 83 |
| 2008 | 62 | 100 |
| 2009 | 40 | 93 |
| 2010 | 67 | 76 |
| 2011 | 69 | 54 |
| 2012 | 48 | 43 |
| 2013 | 61 | 25 |
| 2014 | 37 | 34 |
| 2015 | 36 | 47 |
| 2016 | 33 | 31 |
| 2017 | 31 | 37 |
| 2018 | 34 | 30 |
| 2019 | 30 | 22 |
| 2020 | 32 | 29 |
| 2021 | 24 | 33 |
| 2022 | 36 | 43 |
| 2023 | 25 | 39 |
| 2024 | 25 | 35 |
| 2025 | 20 | 53 |
| 2026 | 18 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Printed circuit board15 Sep 2026US 12,739,975 B2Samsung Electro-Mechanics Co., Ltd.
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Circuit board4 Aug 2026US 12,702,024 B2LG Innotek Co., Ltd.
- Electronic device14 Jul 2026US 12,684,690 B2Panelsemi Corporation
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier With Porous Body, and Manufacture Method1 Oct 2026US 2026/0304615 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Circuit board and manufacturing method thereof17 Sep 2026US 2026/0282211 A1Unimicron Technology Corp.
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993