Electronic device

An electronic device, comprising:

• a first substrate and a second substrate stacked on each other, wherein each of the first substrate and the second substrate has an inner surface and an outer surface, the inner surfaces of the first substrate and the second substrate face to each other, and the outer surfaces of the first substrate and the second substrate are away from each other;
• a plurality of pad groups, wherein each of the pad groups comprises two conductive pads, and the two conductive pads of one of the pad groups are respectively disposed at the outer surfaces of the first substrate and the second substrate and are corresponded to each other;
• a plurality of channels communicating with the first substrate and the second substrate, wherein each of the channels corresponds to one of the pad groups, and two ends of each of the channels are respectively sealed by the two conductive pads of the corresponding pad group;
• a plurality of conductive members disposed in the channels respectively, wherein each of the conductive members electrically connects to the two conductive pads of the corresponding pad group;
• and
• a bonding layer arranged between the first substrate and the second substrate, wherein each of the conductive members passes through the bonding layer.