Circuit board and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsKai-Yi YU, Pu-Ju LIN, Wei-Tse HO, Cheng-Ta KO
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AssigneeUnimicron Technology Corp.
InventorsKai-Yi YU, Pu-Ju LIN, Wei-Tse HO, Cheng-Ta KO
Estimating the term…
A circuit board and a manufacturing method thereof. The circuit board includes a glass substrate, a first build-up structure and at least one crack blocking structure. The glass substrate has a bottom surface, a top surface and a first side surface. The bottom surface and the top surface face away from each other. The first side surface connects the bottom surface and the top surface. The first build-up structure is disposed on the bottom surface or the top surface. The at least one crack blocking structure is disposed in the glass substrate and located adjacent to the first side surface.
A circuit board, comprising:
A manufacturing method of circuit board, comprising:
Dependencies are inferred from the claim text.