H05K 2201/09527
Inverse blind vias, i.e. bottoms outwards in multilayer pcb
Official title: Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
H05K2201/09527 (Inverse blind vias, i.e. bottoms outwards in multilayer pcb) appears on 102 US grants and 146 published applications in this corpus.
Search patents in H05K- Granted patents
- 102
- Published applications
- 146
- Assignees
- 53
- Inventors
- 252
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 3 |
| 2002 | 2 | 2 |
| 2003 | 3 | 7 |
| 2004 | 3 | 1 |
| 2005 | 4 | 6 |
| 2006 | 4 | 6 |
| 2007 | 2 | 4 |
| 2008 | 4 | 5 |
| 2009 | 2 | 10 |
| 2010 | 4 | 9 |
| 2011 | 5 | 8 |
| 2012 | 6 | 5 |
| 2013 | 9 | 8 |
| 2014 | 4 | 5 |
| 2015 | 8 | 11 |
| 2016 | 5 | 2 |
| 2017 | 6 | 9 |
| 2018 | 9 | 4 |
| 2019 | 1 | 3 |
| 2020 | 3 | 1 |
| 2021 | 0 | 2 |
| 2022 | 2 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 2 |
| 2025 | 1 | 12 |
| 2026 | 2 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device30 Jun 2026US 12,671,160 B2Murata Manufacturing Co., Ltd.
- Printed circuit board and wire arrangement method thereof14 Jan 2025US 12,200,863 B2Celestica Technology Consultancy (Shanghai) Co. Ltd
- Fibrillated liquid crystal polymer powder, method of producing fibrillated liquid crystal polymer powder, paste, resin multilayer substrate, and method of producing resin multilayer substrate9 May 2023US 11,646,127 B2Murata Manufacturing Co., Ltd.
- Printed wiring board and method of manufacturing printed wiring board27 Dec 2022US 11,540,390 B2KYOCERA Corporation
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Multi-layer board17 Sep 2026US 2026/0282226 A1Tong Hsing Electronic Industries, Ltd.
- Hybrid circuit board10 Sep 2026US 2026/0271185 A1Tong Hsing Electronic Industries, Ltd.
- Printed circuit board27 Aug 2026US 2026/0255473 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer wiring substrate13 Aug 2026US 2026/0239530 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Planar redistribution structure and printed wiring device239US 5,774,340 AInternational Business Machines Corporation · 1998
- PCB droplet actuator fabrication112US 8,268,246 B2Advanced Liquid Logic, Inc. · 2012
- Printed wiring board and method for producing the same106US 6,715,204 B1Ibiden Co., Ltd. · 2004
- Method of making multilayered substrate for semiconductor device101US 6,418,615 B1Shinko Electronics Industries, Co., Ltd. · 2002