Hybrid circuit board

A hybrid circuit board, comprising:

• a multi-layer board including:
• a first core layer including:
• a first substrate having a first thru-hole, wherein the first substrate is a ceramic substrate;
• and
• a first conductor filled in the first thru-hole, wherein the first conductor has a first internal connection surface that is coplanar with a surface of the first substrate;
• a second core layer stacked on the first core layer along a thickness direction and including:
• a second substrate having a second thru-hole, wherein the second substrate is one of a ceramic substrate, a glass substrate, and a copper foil substrate;
• and
• a second conductor filled in the second thru-hole, wherein the second conductor has a second internal connection surface that is coplanar with a surface of the second substrate, wherein the first internal connection surface of the first core layer faces the second internal connection surface of the second core layer along the thickness direction;
• and
• a connection layer connected between the first core layer and the second core layer, wherein the connection layer includes:
• an insulating layer sandwiched between the first substrate and the second substrate;
• and
• a conductive paste embedded in the insulating layer, wherein the conductive paste connects and is sintered to the first internal connection surface of the first conductor and the second internal connection surface of the second conductor;
• and
• a first stacked layer and a second stacked layer respectively formed on two opposite sides of the multi-layer board, wherein the first stacked layer and the second stacked layer are electrically coupled to each other through the multi-layer board, and wherein each of the first stacked layer and the second stacked layer is configured to allow at least one electronic component to be connected thereon.