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US 2026/0304615 A1Published application
Component Carrier With Porous Body, and Manufacture Method
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsStefano Sergio OGGIONI, Karl Philipp KIRCHHEIMER
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Abstract
A component carrier having a stack with i) at least one electrically conductive layer structure, ii) at least one electrically insulating layer structure, and iii) at least one porous body embedded in the stack, wherein the porous body has an external surface configured to hinder a flow of material of the at least one electrically insulating layer structure inside the porous body.
Claims20
A component carrier having a stack, comprising:
- at least one electrically conductive layer structure,
- at least one electrically insulating layer structure, and
- at least one porous body embedded in the stack,
- wherein the porous body has an external surface configured to hinder a flow of material of the at least one electrically insulating layer structure inside the porous body.
1 more element
A method of manufacturing a component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- embedding at least one porous body in the stack,
- wherein the porous body has an external surface hindering a flow of material of the at least one electrically insulating layer structure inside the porous body.
1 more element
Dependencies are inferred from the claim text.