Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJae Heun Lee
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including: a glass layer; a first wiring layer disposed on an upper surface of the glass layer; and a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of the plurality of blind holes, a second electrode layer disposed on the first electrode layer and disposed in each of the plurality of blind holes, and a first dielectric layer disposed between the first and second electrode layers.
Claims21
A printed circuit board comprising:
- a glass layer;
- a first wiring layer disposed on an upper surface of the glass layer;
- and
- a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of the plurality of blind holes, a second electrode layer disposed on the first electrode layer and disposed in each of the plurality of blind holes, and a first dielectric layer disposed between the first and second electrode layers,
- wherein at least a part of the first electrode layer extends along the upper surface of the glass layer so as not to be covered with the second electrode layer, and
- wherein the blind holes are spaced apart from the lower surface of the glass layer.
A printed circuit board comprising:
- a glass layer;
- a through-hole penetrating through the glass layer from an upper surface to a lower surface of the glass layer;
- a plurality of blind holes respectively penetrating through a portion of the glass layer from the upper surface to the lower surface of the glass layer;
- a first conductor layer disposed on the upper surface and the lower surface of the glass layer and extending onto a wall surface of the through-hole and a wall surface and a bottom surface of each of the plurality of blind holes;
- a third conductor layer disposed on the first conductor layer and disposed in the through-hole and each of the plurality of blind holes;
- and
- a dielectric layer disposed between the first and third conductor layers, on the upper surface of the glass layer, the wall surface of the through-hole, and the wall surface and the bottom surface of each of the plurality of blind holes,
- wherein the blind holes are spaced apart from the lower surface of the glass layer.
Dependencies are inferred from the claim text.