H05K 1/113
Via provided in pad
Official title: {Via provided in pad; Pad over filled via}
H05K1/113 (Via provided in pad) appears on 1,467 US grants and 1,677 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,467
- Published applications
- 1,677
- Assignees
- 493
- Inventors
- 3,323
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 8 | 0 |
| 1995 | 10 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 24 | 0 |
| 1999 | 22 | 0 |
| 2000 | 19 | 0 |
| 2001 | 29 | 14 |
| 2002 | 25 | 31 |
| 2003 | 34 | 43 |
| 2004 | 36 | 44 |
| 2005 | 20 | 45 |
| 2006 | 41 | 52 |
| 2007 | 29 | 38 |
| 2008 | 42 | 53 |
| 2009 | 23 | 42 |
| 2010 | 38 | 56 |
| 2011 | 37 | 49 |
| 2012 | 48 | 62 |
| 2013 | 56 | 68 |
| 2014 | 49 | 71 |
| 2015 | 63 | 90 |
| 2016 | 84 | 84 |
| 2017 | 74 | 77 |
| 2018 | 77 | 72 |
| 2019 | 77 | 63 |
| 2020 | 73 | 95 |
| 2021 | 80 | 92 |
| 2022 | 69 | 88 |
| 2023 | 69 | 91 |
| 2024 | 66 | 90 |
| 2025 | 69 | 89 |
| 2026 | 45 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board1 Oct 2026US 2026/0304634 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Planar redistribution structure and printed wiring device239US 5,774,340 AInternational Business Machines Corporation · 1998
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998