H05K 1/11
Printed elements for providing electric connections to or between printed circuits
H05K1/11 (Printed elements for providing electric connections to or between printed circuits) appears on 13,297 US grants and 14,791 published applications in this corpus.
Search patents in H05K- Granted patents
- 13,297
- Published applications
- 14,791
- Assignees
- 3,016
- Inventors
- 24,175
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 10 | 0 |
| 1978 | 13 | 0 |
| 1979 | 8 | 0 |
| 1980 | 15 | 0 |
| 1981 | 14 | 0 |
| 1982 | 12 | 0 |
| 1983 | 17 | 0 |
| 1984 | 11 | 0 |
| 1985 | 29 | 0 |
| 1986 | 28 | 0 |
| 1987 | 39 | 0 |
| 1988 | 33 | 0 |
| 1989 | 52 | 0 |
| 1990 | 66 | 0 |
| 1991 | 62 | 0 |
| 1992 | 44 | 0 |
| 1993 | 67 | 0 |
| 1994 | 80 | 0 |
| 1995 | 99 | 0 |
| 1996 | 68 | 0 |
| 1997 | 95 | 0 |
| 1998 | 130 | 0 |
| 1999 | 133 | 0 |
| 2000 | 164 | 0 |
| 2001 | 232 | 103 |
| 2002 | 237 | 232 |
| 2003 | 244 | 247 |
| 2004 | 239 | 315 |
| 2005 | 168 | 332 |
| 2006 | 242 | 422 |
| 2007 | 263 | 427 |
| 2008 | 303 | 450 |
| 2009 | 228 | 429 |
| 2010 | 282 | 352 |
| 2011 | 314 | 321 |
| 2012 | 335 | 364 |
| 2013 | 302 | 462 |
| 2014 | 328 | 584 |
| 2015 | 449 | 841 |
| 2016 | 625 | 746 |
| 2017 | 779 | 800 |
| 2018 | 779 | 793 |
| 2019 | 926 | 934 |
| 2020 | 866 | 963 |
| 2021 | 745 | 847 |
| 2022 | 753 | 839 |
| 2023 | 650 | 800 |
| 2024 | 636 | 805 |
| 2025 | 661 | 701 |
| 2026 | 413 | 682 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,318 B2Dongwoo Fine-Chem Co., Ltd.
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Circuit board unit and electronic apparatus6 Oct 2026US 12,757,325 B2Seiko Epson Corporation
- Electronic device8 Oct 2026US 2026/0311925 A1Denso Corporation
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002