H05K 1/115
Via connections
Official title: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
H05K1/115 (Via connections) appears on 4,065 US grants and 5,104 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,065
- Published applications
- 5,104
- Assignees
- 1,204
- Inventors
- 8,453
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 13 | 0 |
| 1994 | 10 | 0 |
| 1995 | 23 | 0 |
| 1996 | 9 | 0 |
| 1997 | 16 | 0 |
| 1998 | 19 | 0 |
| 1999 | 18 | 0 |
| 2000 | 14 | 0 |
| 2001 | 34 | 16 |
| 2002 | 44 | 43 |
| 2003 | 36 | 47 |
| 2004 | 44 | 77 |
| 2005 | 34 | 76 |
| 2006 | 68 | 96 |
| 2007 | 49 | 111 |
| 2008 | 73 | 103 |
| 2009 | 58 | 105 |
| 2010 | 70 | 88 |
| 2011 | 66 | 82 |
| 2012 | 87 | 103 |
| 2013 | 76 | 147 |
| 2014 | 77 | 165 |
| 2015 | 147 | 327 |
| 2016 | 216 | 296 |
| 2017 | 299 | 306 |
| 2018 | 303 | 310 |
| 2019 | 357 | 344 |
| 2020 | 321 | 316 |
| 2021 | 270 | 314 |
| 2022 | 253 | 290 |
| 2023 | 235 | 322 |
| 2024 | 230 | 303 |
| 2025 | 265 | 316 |
| 2026 | 162 | 401 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,318 B2Dongwoo Fine-Chem Co., Ltd.
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Printed circuit board6 Oct 2026US 12,757,328 B2Samsung Electro-Mechanics Co., Ltd.
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
Most cited
By later US patents
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Midplane especially applicable to an orthogonal architecture electronic system215US 7,108,556 B2Amphenol Corporation · 2006
- Method for reducing via inductance in an electronic assembly and article190US 6,021,564 AW. L. Gore & Associates, Inc. · 2000
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002