H05K 1/116
Lands, clearance holes or other lay-out details concerning the surrounding of a
Official title: {Lands, clearance holes or other lay-out details concerning the surrounding of a via}
H05K1/116 (Lands, clearance holes or other lay-out details concerning the surrounding of a) appears on 979 US grants and 1,135 published applications in this corpus.
Search patents in H05K- Granted patents
- 979
- Published applications
- 1,135
- Assignees
- 469
- Inventors
- 2,414
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 10 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 22 | 12 |
| 2002 | 23 | 21 |
| 2003 | 22 | 24 |
| 2004 | 22 | 28 |
| 2005 | 15 | 21 |
| 2006 | 25 | 35 |
| 2007 | 10 | 41 |
| 2008 | 32 | 53 |
| 2009 | 31 | 54 |
| 2010 | 32 | 36 |
| 2011 | 34 | 38 |
| 2012 | 42 | 35 |
| 2013 | 31 | 36 |
| 2014 | 20 | 36 |
| 2015 | 36 | 59 |
| 2016 | 32 | 37 |
| 2017 | 41 | 34 |
| 2018 | 39 | 44 |
| 2019 | 55 | 54 |
| 2020 | 49 | 47 |
| 2021 | 43 | 46 |
| 2022 | 44 | 60 |
| 2023 | 44 | 75 |
| 2024 | 47 | 60 |
| 2025 | 55 | 74 |
| 2026 | 35 | 75 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board6 Oct 2026US 12,757,318 B2Dongwoo Fine-Chem Co., Ltd.
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Printed circuit board15 Sep 2026US 12,739,975 B2Samsung Electro-Mechanics Co., Ltd.
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Substrate and electronic device24 Sep 2026US 2026/0292970 A1Kioxia Corporation
- Printed circuit board24 Sep 2026US 2026/0292985 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Midplane especially applicable to an orthogonal architecture electronic system215US 7,108,556 B2Amphenol Corporation · 2006
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- Generic solar cell array using a printed circuit substrate130US 5,185,042 ATRW Inc. · 1993
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- PCB design and method for providing vented blind vias122US 6,787,443 B1Intel Corporation · 2004