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US 2026/0292985 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Kuk Ko, Sanghoon Kim, Gyumook Kim, Taehun Kim
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Abstract
A printed circuit board according to an embodiment may comprise an insulating layer, a wiring layer embedded in the insulating layer, a solder resist layer positioned on the insulating layer, a cavity penetrating the solder resist layer and a portion of the insulating layer, and a blocking pattern positioned on the insulating layer, surrounding an edge of the cavity, and covered by the solder resist layer.
Claims20
A printed circuit board, comprising:
- an insulating layer;
- a wiring layer embedded in the insulating layer;
- a solder resist layer positioned on the insulating layer;
- a cavity penetrating the solder resist layer and a portion of the insulating layer;
- and
- a blocking pattern positioned on the insulating layer, surrounding an edge of the cavity, and covered by the solder resist layer.
3 more elements
Dependencies are inferred from the claim text.