H05K 1/00
Printed circuits
H05K1/00 (Printed circuits) appears on 59,519 US grants and 63,333 published applications in this corpus.
Search patents in H05K- Granted patents
- 59,519
- Published applications
- 63,333
- Assignees
- 10,544
- Inventors
- 94,756
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 128 | 0 |
| 1977 | 103 | 0 |
| 1978 | 123 | 0 |
| 1979 | 85 | 0 |
| 1980 | 128 | 0 |
| 1981 | 151 | 0 |
| 1982 | 175 | 0 |
| 1983 | 188 | 0 |
| 1984 | 190 | 0 |
| 1985 | 287 | 0 |
| 1986 | 262 | 0 |
| 1987 | 344 | 0 |
| 1988 | 369 | 0 |
| 1989 | 459 | 0 |
| 1990 | 480 | 0 |
| 1991 | 523 | 0 |
| 1992 | 507 | 0 |
| 1993 | 517 | 0 |
| 1994 | 537 | 0 |
| 1995 | 548 | 0 |
| 1996 | 527 | 0 |
| 1997 | 578 | 0 |
| 1998 | 781 | 0 |
| 1999 | 876 | 0 |
| 2000 | 861 | 0 |
| 2001 | 1099 | 486 |
| 2002 | 1251 | 1526 |
| 2003 | 1357 | 1580 |
| 2004 | 1352 | 1922 |
| 2005 | 1165 | 2058 |
| 2006 | 1339 | 2249 |
| 2007 | 1350 | 2229 |
| 2008 | 1294 | 2387 |
| 2009 | 1320 | 2534 |
| 2010 | 1550 | 2265 |
| 2011 | 1645 | 1849 |
| 2012 | 1786 | 1863 |
| 2013 | 1551 | 2249 |
| 2014 | 1607 | 2785 |
| 2015 | 1972 | 3062 |
| 2016 | 2385 | 2721 |
| 2017 | 2704 | 2789 |
| 2018 | 2618 | 2993 |
| 2019 | 3083 | 3343 |
| 2020 | 3010 | 3451 |
| 2021 | 2684 | 3162 |
| 2022 | 2609 | 3095 |
| 2023 | 2434 | 3058 |
| 2024 | 2551 | 3016 |
| 2025 | 2542 | 2589 |
| 2026 | 1534 | 2072 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board6 Oct 2026US 12,753,301 B2Panasonic Intellectual Property Management Co., Ltd.
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Printed circuit board to dielectric waveguide interface6 Oct 2026US 12,756,084 B1Northrop Grumman Systems Corporation
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Resin composition, film, metal-clad laminate, and circuit board8 Oct 2026US 2026/0308452 A1Kuraray Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Display device8 Oct 2026US 2026/0310021 A1Wuhan China Star Optoelectronics Technology Co., Ltd.
- Electronic device8 Oct 2026US 2026/0310260 A1Samsung Display Co., Ltd.
- Magnetic composition, magnetic film, stack, and circuit member8 Oct 2026US 2026/0311918 A1
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Programmer1,483US 4,213,562 A1980
- Surgical system instrument sterile adapter1,479US 9,096,033 B2Intuitive Surgical Operations, Inc. · 2015
- Modular transaction terminal1,375US 6,065,679 AIVI Checkmate Corp. · 2000
- Medication package and method1,358US 7,126,879 B2HealthTRAC Systems, Inc. · 2006