H05K 1/16
Incorporating printed electric components
Official title: incorporating printed electric components, e.g. printed resistors, capacitors or inductors
H05K1/16 (Incorporating printed electric components) appears on 5,135 US grants and 5,331 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,135
- Published applications
- 5,331
- Assignees
- 1,817
- Inventors
- 9,989
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 11 | 0 |
| 1978 | 11 | 0 |
| 1979 | 7 | 0 |
| 1980 | 16 | 0 |
| 1981 | 13 | 0 |
| 1982 | 22 | 0 |
| 1983 | 14 | 0 |
| 1984 | 16 | 0 |
| 1985 | 24 | 0 |
| 1986 | 14 | 0 |
| 1987 | 20 | 0 |
| 1988 | 28 | 0 |
| 1989 | 38 | 0 |
| 1990 | 33 | 0 |
| 1991 | 49 | 0 |
| 1992 | 47 | 0 |
| 1993 | 35 | 0 |
| 1994 | 33 | 0 |
| 1995 | 36 | 0 |
| 1996 | 29 | 0 |
| 1997 | 50 | 0 |
| 1998 | 54 | 0 |
| 1999 | 102 | 0 |
| 2000 | 79 | 0 |
| 2001 | 110 | 49 |
| 2002 | 125 | 200 |
| 2003 | 142 | 204 |
| 2004 | 176 | 255 |
| 2005 | 163 | 256 |
| 2006 | 188 | 329 |
| 2007 | 174 | 274 |
| 2008 | 161 | 251 |
| 2009 | 167 | 225 |
| 2010 | 200 | 191 |
| 2011 | 169 | 149 |
| 2012 | 150 | 154 |
| 2013 | 135 | 168 |
| 2014 | 145 | 174 |
| 2015 | 152 | 194 |
| 2016 | 152 | 167 |
| 2017 | 161 | 192 |
| 2018 | 181 | 211 |
| 2019 | 230 | 282 |
| 2020 | 188 | 277 |
| 2021 | 198 | 223 |
| 2022 | 223 | 220 |
| 2023 | 203 | 209 |
| 2024 | 161 | 208 |
| 2025 | 188 | 152 |
| 2026 | 96 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Method and system for detection and analysis of chemical compounds in a sample subjected to a chromatographic separation on a layered separating medium29 Sep 2026US 12,748,088 B2Technion Research & Development Foundation Limited
- Surge suppression device29 Sep 2026US 12,749,890 B2Proterial, Ltd.
- Printed circuit board15 Sep 2026US 12,739,975 B2Samsung Electro-Mechanics Co., Ltd.
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Multiphase power module with paired power stages and embedded inductors1 Oct 2026US 2026/0304628 A1Quanta Computer Inc.
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
- Circuit board of electrical connection device, and electrical connection device24 Sep 2026US 2026/0291152 A1Gd Midea Air-Conditioning Equipment Co., Ltd.
- Cooking apparatus24 Sep 2026US 2026/0292943 A1LG Electronics Inc.
Most cited
By later US patents
- Transferred flexible integrated circuit464US 6,027,958 AKopin Corporation · 2000
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006