H05K 1/165
Incorporating printed inductors
Official title: {incorporating printed inductors}
H05K1/165 (Incorporating printed inductors) appears on 2,000 US grants and 2,207 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,000
- Published applications
- 2,207
- Assignees
- 885
- Inventors
- 4,328
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 14 | 0 |
| 1998 | 15 | 0 |
| 1999 | 32 | 0 |
| 2000 | 25 | 0 |
| 2001 | 37 | 13 |
| 2002 | 46 | 61 |
| 2003 | 31 | 56 |
| 2004 | 51 | 66 |
| 2005 | 48 | 64 |
| 2006 | 46 | 77 |
| 2007 | 47 | 67 |
| 2008 | 44 | 48 |
| 2009 | 49 | 64 |
| 2010 | 47 | 55 |
| 2011 | 57 | 56 |
| 2012 | 41 | 47 |
| 2013 | 42 | 70 |
| 2014 | 55 | 74 |
| 2015 | 57 | 88 |
| 2016 | 67 | 68 |
| 2017 | 74 | 103 |
| 2018 | 90 | 110 |
| 2019 | 121 | 158 |
| 2020 | 94 | 164 |
| 2021 | 120 | 137 |
| 2022 | 140 | 141 |
| 2023 | 133 | 135 |
| 2024 | 104 | 117 |
| 2025 | 119 | 90 |
| 2026 | 54 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Circuit device and display apparatus25 Aug 2026US 12,720,676 B2Boe Technology Group Co., Ltd.
- Device having an in-substrate inductor and method for making the inductor25 Aug 2026US 12,720,774 B2QUALCOMM Incorporated
- Multiphase power module with paired power stages and embedded inductors1 Oct 2026US 2026/0304628 A1Quanta Computer Inc.
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
- Circuit board of electrical connection device, and electrical connection device24 Sep 2026US 2026/0291152 A1Gd Midea Air-Conditioning Equipment Co., Ltd.
- Cooking apparatus24 Sep 2026US 2026/0292943 A1LG Electronics Inc.
- Method to integrate micro transformers into printed circuit board for step-down voltages24 Sep 2026US 2026/0292992 A1Cisco Technology, Inc.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- Electrically active textiles and articles made therefrom283US 6,210,771 B1Massachusetts Institute of Technology · 2001
- High-voltage module for an external defibrillator243US 7,865,238 B2Koninklijke Philips Electronics N. V. · 2011