Method to integrate micro transformers into printed circuit board for step-down voltages

An apparatus comprising:

• a printed circuit board comprising a plurality of layers;
• a first transformer monument structure implemented in the plurality of layers of the printed circuit board and comprising:
• a transformer core formed in a hole through the plurality of layers of the printed circuit board;
• and
• a transformer primary conductive path formed around the transformer core through the plurality of layers of the printed circuit board;
• a second transformer monument structure implemented in the plurality of layers of the printed circuit board spaced from the first transformer monument structure, and comprising:
• a transformer core formed in a hole through the plurality of layers of the printed circuit board;
• and
• a transformer secondary conductive path formed around the transformer core through the plurality of layers of the printed circuit board;
• and
• a first magnetic material layer extending on a first outermost layer between the transformer core of the first transformer monument structure and the transformer core of the second transformer monument structure and a second magnetic material layer extending on a second outermost layer between the transformer core of the first transformer monument structure and the transformer core of the second transformer monument structure.

An apparatus comprising:

• a printed circuit board having a plurality of layers;
• a plurality of transformer cores implemented in the plurality of layers of the printed circuit board;
• a first plated layer extending on a first outermost layer of the plurality of layers at a first end of the plurality of transformer cores;
• a second plated layer extending on a second outermost layer of the plurality of layers at a second end of the plurality of transformer cores;
• and
• an inner conductive layer formed in one or more of the plurality of layers of the printed circuit board between rows of the plurality of transformer cores, and between the first plated layer and the second plated layer, the inner conductive layer configured to receive a current to flow therethrough and for which a measurement is to be made.