H05K 1/162
Incorporating printed capacitors
Official title: {incorporating printed capacitors}
H05K1/162 (Incorporating printed capacitors) appears on 2,001 US grants and 2,015 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,001
- Published applications
- 2,015
- Assignees
- 730
- Inventors
- 3,791
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 7 | 0 |
| 1981 | 5 | 0 |
| 1982 | 11 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 9 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 13 | 0 |
| 1990 | 11 | 0 |
| 1991 | 23 | 0 |
| 1992 | 16 | 0 |
| 1993 | 11 | 0 |
| 1994 | 13 | 0 |
| 1995 | 16 | 0 |
| 1996 | 16 | 0 |
| 1997 | 18 | 0 |
| 1998 | 25 | 0 |
| 1999 | 52 | 0 |
| 2000 | 30 | 0 |
| 2001 | 42 | 29 |
| 2002 | 61 | 87 |
| 2003 | 83 | 99 |
| 2004 | 79 | 118 |
| 2005 | 79 | 124 |
| 2006 | 90 | 158 |
| 2007 | 80 | 155 |
| 2008 | 76 | 126 |
| 2009 | 94 | 113 |
| 2010 | 110 | 89 |
| 2011 | 84 | 62 |
| 2012 | 75 | 79 |
| 2013 | 59 | 56 |
| 2014 | 63 | 48 |
| 2015 | 53 | 71 |
| 2016 | 53 | 57 |
| 2017 | 57 | 66 |
| 2018 | 69 | 55 |
| 2019 | 73 | 76 |
| 2020 | 52 | 77 |
| 2021 | 54 | 57 |
| 2022 | 48 | 40 |
| 2023 | 50 | 47 |
| 2024 | 28 | 61 |
| 2025 | 40 | 41 |
| 2026 | 31 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board15 Sep 2026US 12,739,975 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Electronic device including dew condensation sensor18 Aug 2026US 12,710,389 B2LG Electronics Inc.
- Fully printed sensor with internal ion reservoirs18 Aug 2026US 12,713,530 B2The Regents of the University of Colorado
- Conformable thin film-based strain sensing with flexible substrate11 Aug 2026US 12,704,421 B2The Regents of the University of Michigan
- Circuit board of electrical connection device, and electrical connection device24 Sep 2026US 2026/0291152 A1Gd Midea Air-Conditioning Equipment Co., Ltd.
- Printed circuit board27 Aug 2026US 2026/0255490 A1Samsung Electro-Mechanics Co., Ltd.
- High-voltage printed circuit board with integrated plasma discharge electrodes for scalable plasma-based water treatment systems13 Aug 2026US 2026/0239528 A1Black Spark Inc
- Semiconductor Package with Integrated Capacitors13 Aug 2026US 2026/0239991 A1Chipletz, Inc.
- Multilayer body, capacitor, electrical circuit, circuit board, apparatus, and multilayer body manufacturing method6 Aug 2026US 2026/0229408 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Electrically active textiles and articles made therefrom283US 6,210,771 B1Massachusetts Institute of Technology · 2001
- Capacitive touch entry apparatus having high degree of personal safety239US 4,290,052 AGeneral Electric Company · 1981