Resin composition, film, metal-clad laminate, and circuit board

2:

• The resin composition according to claim 1, wherein the resin composition has a melt viscosity of 30 to 120 Pa·s, where the melt viscosity is measured using a capillary rheometer under the following conditions:
• a capillary diameter of 1.0 mm, a capillary length of 20 mm, a temperature of the endothermic peak temperature Tm1+20° C., a shear rate of 1000 sec−1, and a preheating time of 5 minutes.

3:

• The resin composition according to claim 1, wherein the resin composition has a melt tension of 0.002 N or more, where the melt tension is measured using a capillary rheometer by taking up the resin composition at a speed of 30 m/min, with a distance from a capillary outlet to a center position of a tension pulley set at 200 mm, under the following conditions:
• a capillary diameter of 1.0 mm, a capillary length of 20 mm, a temperature of the endothermic peak temperature Tm1+20° C., a shear rate of 1000 sec−1, and a preheating time of 5 minutes.

4:

• The resin composition according to claim 1, wherein the resin composition has a difference between Tm1 and Tm6 (Tm1−Tm6), of 12° C. or less, where Tm1 denotes an endothermic peak temperature during a first heating run and Tm6 denotes an endothermic peak temperature during a sixth heating run, when a heating and cooling cycle is repeated using a differential scanning calorimeter under a heating condition where a temperature is increased from 25° C. to 400° C. at a rate of 20° C./min and is maintained for 2 minutes after the temperature reaches 400° C. and a cooling condition where the temperature is decreased from 400° C. to 25° C. at a rate of 20° C./min and is maintained for 2 minutes after the temperature reaches 25° C.

5:

• The resin composition according to claim 1, wherein the resin composition has a ratio Y/X of 1.30 or less, where X denotes a melt viscosity (Pa·s) measured using a capillary rheometer under the following conditions:
• a capillary diameter of 1.0 mm, a capillary length of 20 mm, a temperature of the endothermic peak temperature Tm1+20° C., a shear rate of 1000 sec−1, and a preheating time of 5 minutes, and Y denotes a melt viscosity (Pa·s) subsequently measured under conditions of the same temperature and shear rate after the resin composition is allowed to stand at the same temperature in a barrel of the capillary rheometer for 30 minutes.

7:

• The resin composition according to claim 6, wherein the thermoplastic liquid crystal polymer contains a total of 40 mol % or more of a repeating unit including a 2,6-naphthylene group based on the total content of all the repeating units.

8:

• The resin composition according to claim 1, further comprising particulate materials.

9:

• The resin composition according to claim 1, further comprising an additive material, wherein the additive material is at least one selected from the group consisting of a thermoplastic resin, a thermosetting resin, an inorganic compound, and a liquid crystalline oligomer.

10:

• The resin composition according to claim 9, wherein the additive material comprises a thermoplastic resin, which is at least one selected from the group consisting of an amorphous polyarylate-based resin, a polyphenylene ether-based resin, a polyphenylene sulfide-based resin, a polyetherimide-based resin, a polyether sulfone-based resin, a polycarbonate-based resin, a polyether ether ketone-based resin, and a fluorine-based resin.

11:

• The resin composition according to claim 9, wherein the additive material comprises an inorganic compound, which is at least one selected from the group consisting of silica and titanium oxide.

12:

• The resin composition according to claim 9, wherein the additive material comprises two or more types of inorganic particles having different median diameters from each other.

13:

• The resin composition according to claim 9, comprising two or more types of the additive material.

14:

• The resin composition according to claim 9, wherein a weight ratio of the thermoplastic liquid crystal polymer to the additive material is in a range of from 63.0/37.0 to 94.9/5.1.

15:

• A film, comprising:
• the resin composition according to claim 1.

16:

• The film according to claim 15, having a thickness of 5 to 200 μm.

17:

• The film according to claim 15, having a coefficient of variation of thickness in a film width direction of 1.90% or less as measured using a continuous thickness gauge.

18:

• A metal-clad laminate, comprising:
• the film according to claim 15 and
• a metal layer bonded to at least one surface of the film.

19:

• A circuit board, comprising:
• a conductor layer, and
• an insulating layer containing the resin composition according to claim 1.