H05K 1/02
Details
H05K1/02 (Details) appears on 52,025 US grants and 54,734 published applications in this corpus.
Search patents in H05K- Granted patents
- 52,025
- Published applications
- 54,734
- Assignees
- 9,497
- Inventors
- 85,008
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 117 | 0 |
| 1977 | 90 | 0 |
| 1978 | 105 | 0 |
| 1979 | 65 | 0 |
| 1980 | 111 | 0 |
| 1981 | 133 | 0 |
| 1982 | 162 | 0 |
| 1983 | 179 | 0 |
| 1984 | 177 | 0 |
| 1985 | 263 | 0 |
| 1986 | 242 | 0 |
| 1987 | 325 | 0 |
| 1988 | 346 | 0 |
| 1989 | 432 | 0 |
| 1990 | 442 | 0 |
| 1991 | 477 | 0 |
| 1992 | 478 | 0 |
| 1993 | 484 | 0 |
| 1994 | 516 | 0 |
| 1995 | 504 | 0 |
| 1996 | 491 | 0 |
| 1997 | 521 | 0 |
| 1998 | 723 | 0 |
| 1999 | 787 | 0 |
| 2000 | 771 | 0 |
| 2001 | 999 | 440 |
| 2002 | 1150 | 1350 |
| 2003 | 1216 | 1386 |
| 2004 | 1214 | 1653 |
| 2005 | 1006 | 1797 |
| 2006 | 1154 | 1948 |
| 2007 | 1172 | 1940 |
| 2008 | 1139 | 2086 |
| 2009 | 1143 | 2245 |
| 2010 | 1334 | 1980 |
| 2011 | 1421 | 1631 |
| 2012 | 1581 | 1601 |
| 2013 | 1348 | 1944 |
| 2014 | 1376 | 2451 |
| 2015 | 1726 | 2690 |
| 2016 | 2064 | 2374 |
| 2017 | 2364 | 2375 |
| 2018 | 2271 | 2582 |
| 2019 | 2645 | 2774 |
| 2020 | 2541 | 2950 |
| 2021 | 2287 | 2713 |
| 2022 | 2219 | 2649 |
| 2023 | 2071 | 2597 |
| 2024 | 2183 | 2599 |
| 2025 | 2170 | 2196 |
| 2026 | 1290 | 1783 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 1/03Use of materials for the substrate13,334
- H05K 1/0213Electrical arrangements not otherwise provided for13,327
- H05K 1/11Printed elements for providing electric connections to or between printed circuits13,297
- H05K 1/14Structural association of two or more printed circuits9,481
- H05K 1/0201Thermal arrangements5,895
- H05K 1/09Use of materials for the conductive5,243
- H05K 1/0277Bendability or stretchability details4,093
- H05K 1/0296Conductive pattern lay-out details not covered by sub groups h05k1/02 - h05k1/02953,453
All 15 subgroupsShow fewer
- H05K 1/0266Marks, test patterns or identification means2,448
- H05K 1/0271Arrangements for reducing stress or warp in rigid printed circuit boards2,081
- H05K 1/0274Optical details1,654
- H05K 1/0286Programmable, customizable or modifiable circuits1,629
- H05K 1/0284Details of three-dimensional rigid printed circuit boards809
- H05K 1/0272Adaptations for fluid transport571
- H05K 1/0275Security details346
Recent patents
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board6 Oct 2026US 12,753,301 B2Panasonic Intellectual Property Management Co., Ltd.
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Printed circuit board to dielectric waveguide interface6 Oct 2026US 12,756,084 B1Northrop Grumman Systems Corporation
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Resin composition, film, metal-clad laminate, and circuit board8 Oct 2026US 2026/0308452 A1Kuraray Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Electronic device8 Oct 2026US 2026/0310260 A1Samsung Display Co., Ltd.
- Magnetic composition, magnetic film, stack, and circuit member8 Oct 2026US 2026/0311918 A1
- Electronic device8 Oct 2026US 2026/0311925 A1Denso Corporation
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Programmer1,483US 4,213,562 A1980
- Modular transaction terminal1,375US 6,065,679 AIVI Checkmate Corp. · 2000
- Medication package and method1,358US 7,126,879 B2HealthTRAC Systems, Inc. · 2006
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990