H05K 1/0272
Adaptations for fluid transport
Official title: {Adaptations for fluid transport, e.g. channels, holes}
H05K1/0272 (Adaptations for fluid transport) appears on 571 US grants and 607 published applications in this corpus.
Search patents in H05K- Granted patents
- 571
- Published applications
- 607
- Assignees
- 434
- Inventors
- 1,554
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 5 | 0 |
| 2001 | 13 | 2 |
| 2002 | 14 | 20 |
| 2003 | 15 | 18 |
| 2004 | 17 | 23 |
| 2005 | 9 | 17 |
| 2006 | 23 | 30 |
| 2007 | 16 | 15 |
| 2008 | 11 | 36 |
| 2009 | 14 | 25 |
| 2010 | 14 | 22 |
| 2011 | 15 | 17 |
| 2012 | 16 | 14 |
| 2013 | 11 | 15 |
| 2014 | 16 | 22 |
| 2015 | 14 | 21 |
| 2016 | 16 | 23 |
| 2017 | 30 | 30 |
| 2018 | 28 | 26 |
| 2019 | 28 | 26 |
| 2020 | 28 | 26 |
| 2021 | 27 | 29 |
| 2022 | 23 | 29 |
| 2023 | 22 | 31 |
| 2024 | 25 | 35 |
| 2025 | 24 | 21 |
| 2026 | 15 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Circuit board11 Aug 2026US 12,707,559 B2LG Innotek Co., Ltd.
- Electronic controller unit28 Jul 2026US 12,696,425 B2Aptiv Technologies AG
- Circuit apparatus for electronic devices14 Jul 2026US 12,684,687 B2Intel Corporation
- Wave soldering device, manufacturing method thereof and printed circuit board14 Jul 2026US 12,684,701 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Liquid Cooling Using PCT Through Holes17 Sep 2026US 2026/0282215 A1Cisco Technology, Inc.
- Device and method for manufacturing solid fuel microthrusters using only pcb-mems technology10 Sep 2026US 2026/0264889 A1Universidad de Sevilla
- Electronic device, vapor chamber, and preparation method therefor10 Sep 2026US 2026/0271232 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Coaxial waveguide microstructures and methods of formation thereof292US 7,012,489 B2Rohm and Haas Electronic Materials LLC · 2006
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Integrated multilayered microfludic devices and methods for making the same242US 6,572,830 B1Motorola, Inc. · 2003