Liquid Cooling Using PCT Through Holes
AssigneeCisco Technology, Inc.
InventorsJordan K. Hu, Tushara Ramesh, Bhumil Depani, Aman Thukral, Jerold M. Pianin, Joel Richard Goergen
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AssigneeCisco Technology, Inc.
InventorsJordan K. Hu, Tushara Ramesh, Bhumil Depani, Aman Thukral, Jerold M. Pianin, Joel Richard Goergen
Estimating the term…
Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.
A system, comprising:
A manifold component, comprising:
A method for mounting an electronic component on a printed circuit board (PCB), comprising:
Dependencies are inferred from the claim text.