H05K 1/09
Use of materials for the conductive
Official title: Use of materials for the {conductive, e.g. } metallic pattern
H05K1/09 (Use of materials for the conductive) appears on 5,243 US grants and 5,441 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,243
- Published applications
- 5,441
- Assignees
- 1,894
- Inventors
- 11,315
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 39 | 0 |
| 1977 | 20 | 0 |
| 1978 | 21 | 0 |
| 1979 | 4 | 0 |
| 1980 | 21 | 0 |
| 1981 | 29 | 0 |
| 1982 | 36 | 0 |
| 1983 | 40 | 0 |
| 1984 | 31 | 0 |
| 1985 | 64 | 0 |
| 1986 | 47 | 0 |
| 1987 | 55 | 0 |
| 1988 | 66 | 0 |
| 1989 | 86 | 0 |
| 1990 | 61 | 0 |
| 1991 | 65 | 0 |
| 1992 | 81 | 0 |
| 1993 | 58 | 0 |
| 1994 | 69 | 0 |
| 1995 | 66 | 0 |
| 1996 | 59 | 0 |
| 1997 | 62 | 0 |
| 1998 | 73 | 0 |
| 1999 | 82 | 0 |
| 2000 | 86 | 0 |
| 2001 | 87 | 44 |
| 2002 | 94 | 121 |
| 2003 | 101 | 129 |
| 2004 | 90 | 143 |
| 2005 | 62 | 186 |
| 2006 | 92 | 126 |
| 2007 | 82 | 162 |
| 2008 | 60 | 148 |
| 2009 | 64 | 198 |
| 2010 | 105 | 162 |
| 2011 | 106 | 123 |
| 2012 | 113 | 141 |
| 2013 | 95 | 201 |
| 2014 | 113 | 291 |
| 2015 | 173 | 427 |
| 2016 | 248 | 392 |
| 2017 | 355 | 358 |
| 2018 | 304 | 303 |
| 2019 | 321 | 300 |
| 2020 | 245 | 265 |
| 2021 | 230 | 265 |
| 2022 | 216 | 240 |
| 2023 | 161 | 184 |
| 2024 | 198 | 173 |
| 2025 | 123 | 148 |
| 2026 | 84 | 211 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Method for manufacturing circuit board29 Sep 2026US 12,750,948 B2Mitsui Kinzoku Company, Limited
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Printed circuit board having connection fingers providing improved electrical contact with corresponding socket connection pins upon insertion8 Oct 2026US 2026/0313797 A1Micron Technology, Inc.
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Substrate1 Oct 2026US 2026/0304617 A1KYOCERA Corporation
Most cited
By later US patents
- Multi-color electrophoretic displays and materials for making the same695US 6,017,584 AE Ink Corporation · 2000
- Electronically addressable microencapsulated ink and display thereof597US 6,120,588 AE Ink Corporation · 2000
- Transducers and indicators having printed displays561US 6,118,426 AE Ink Corporation · 2000
- Electrophoretic displays using nanoparticles501US 6,323,989 B1E Ink Corporation · 2001
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999