H05K 1/092
Dispersed materials
Official title: {Dispersed materials, e.g. conductive pastes or inks}
H05K1/092 (Dispersed materials) appears on 3,418 US grants and 3,134 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,418
- Published applications
- 3,134
- Assignees
- 1,353
- Inventors
- 7,136
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 36 | 0 |
| 1977 | 19 | 0 |
| 1978 | 18 | 0 |
| 1979 | 4 | 0 |
| 1980 | 20 | 0 |
| 1981 | 26 | 0 |
| 1982 | 35 | 0 |
| 1983 | 40 | 0 |
| 1984 | 28 | 0 |
| 1985 | 58 | 0 |
| 1986 | 40 | 0 |
| 1987 | 45 | 0 |
| 1988 | 54 | 0 |
| 1989 | 76 | 0 |
| 1990 | 52 | 0 |
| 1991 | 57 | 0 |
| 1992 | 71 | 0 |
| 1993 | 55 | 0 |
| 1994 | 63 | 0 |
| 1995 | 51 | 0 |
| 1996 | 55 | 0 |
| 1997 | 52 | 0 |
| 1998 | 63 | 0 |
| 1999 | 75 | 0 |
| 2000 | 78 | 0 |
| 2001 | 76 | 41 |
| 2002 | 84 | 102 |
| 2003 | 90 | 110 |
| 2004 | 76 | 124 |
| 2005 | 52 | 167 |
| 2006 | 82 | 108 |
| 2007 | 71 | 140 |
| 2008 | 53 | 121 |
| 2009 | 55 | 162 |
| 2010 | 93 | 131 |
| 2011 | 93 | 79 |
| 2012 | 92 | 94 |
| 2013 | 60 | 108 |
| 2014 | 70 | 163 |
| 2015 | 83 | 205 |
| 2016 | 133 | 178 |
| 2017 | 137 | 142 |
| 2018 | 126 | 155 |
| 2019 | 137 | 139 |
| 2020 | 111 | 121 |
| 2021 | 109 | 141 |
| 2022 | 103 | 113 |
| 2023 | 74 | 91 |
| 2024 | 92 | 79 |
| 2025 | 58 | 71 |
| 2026 | 37 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Haptic apparatus for stimulating users' skin1 Sep 2026US 12,721,997 B2City University of Hong Kong
- Flexible circuit base board and flexible flat cable1 Sep 2026US 12,727,085 B2Avary Holding (Shenzhen) Co., Limited.
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Forming a circuit bearing structure with dielectric ink1 Oct 2026US 2026/0304646 A1LCP Medical Technologies, Inc.
- A Curable Inkjet Composition for the Manufacturing of Printed Circuit Boards24 Sep 2026US 2026/0286155 A1Agfa-Gevaert
- Multi-layer board17 Sep 2026US 2026/0282226 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Multi-color electrophoretic displays and materials for making the same695US 6,017,584 AE Ink Corporation · 2000
- Electronically addressable microencapsulated ink and display thereof597US 6,120,588 AE Ink Corporation · 2000
- Transducers and indicators having printed displays561US 6,118,426 AE Ink Corporation · 2000
- Electrophoretic displays using nanoparticles501US 6,323,989 B1E Ink Corporation · 2001
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999