H05K 1/095
For polymer thick films, i.e. having a permanent organic polymeric binder
Official title: {for polymer thick films, i.e. having a permanent organic polymeric binder}
H05K1/095 (For polymer thick films, i.e. having a permanent organic polymeric binder) appears on 1,193 US grants and 1,062 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,193
- Published applications
- 1,062
- Assignees
- 672
- Inventors
- 2,701
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 11 | 0 |
| 1982 | 7 | 0 |
| 1983 | 21 | 0 |
| 1984 | 13 | 0 |
| 1985 | 20 | 0 |
| 1986 | 14 | 0 |
| 1987 | 22 | 0 |
| 1988 | 23 | 0 |
| 1989 | 22 | 0 |
| 1990 | 18 | 0 |
| 1991 | 20 | 0 |
| 1992 | 28 | 0 |
| 1993 | 19 | 0 |
| 1994 | 23 | 0 |
| 1995 | 21 | 0 |
| 1996 | 17 | 0 |
| 1997 | 19 | 0 |
| 1998 | 24 | 0 |
| 1999 | 39 | 0 |
| 2000 | 33 | 0 |
| 2001 | 32 | 19 |
| 2002 | 31 | 53 |
| 2003 | 42 | 59 |
| 2004 | 37 | 61 |
| 2005 | 32 | 91 |
| 2006 | 37 | 45 |
| 2007 | 40 | 42 |
| 2008 | 22 | 49 |
| 2009 | 15 | 56 |
| 2010 | 31 | 56 |
| 2011 | 37 | 29 |
| 2012 | 39 | 31 |
| 2013 | 22 | 27 |
| 2014 | 25 | 56 |
| 2015 | 23 | 38 |
| 2016 | 27 | 30 |
| 2017 | 26 | 31 |
| 2018 | 28 | 47 |
| 2019 | 37 | 40 |
| 2020 | 32 | 36 |
| 2021 | 26 | 42 |
| 2022 | 34 | 35 |
| 2023 | 25 | 27 |
| 2024 | 26 | 28 |
| 2025 | 21 | 18 |
| 2026 | 11 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible circuit base board and flexible flat cable1 Sep 2026US 12,727,085 B2Avary Holding (Shenzhen) Co., Limited.
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Apparatus and method of producing a sensing substrate4 Aug 2026US 12,698,024 B2Joyson Safety Systems Acquisition LLC
- Donor plate, deposition device and deposition method19 May 2026US 12,635,079 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Conductive ink composition and wiring pattern27 Aug 2026US 2026/0250537 A1Dupont Electronics, Inc.
- Electrochemical biosensors and method of preparing electrochemical biosensors27 Aug 2026US 2026/0251608 A1Glc Medical (Glcm) Inc.
Most cited
By later US patents
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002
- Methods of making garments having stretchable and conductive ink191US 8,945,328 B2L.I.F.E. Corporation S.A. · 2015
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976