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US 2026/0250537 A1Published application
Conductive ink composition and wiring pattern
AssigneeDupont Electronics, Inc.
InventorsYEN MING TSENG, CHING MAO HUANG, TSUNG HAN TSAI, LI YEN LIN
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Abstract
The present disclosure provides a conductive ink composition comprising silver nanoparticles, a binder and a solvent, and has good stringiness when subjected to texture test. The conductive ink composition has good operability and can be printed to produce wiring patterns.
Claims8
A conductive ink composition, which comprises:
- (A) 20 wt % to 95 wt % of silver nanoparticles;
- (B) 0.1 wt % to 20 wt % of a binder;
- and
- (C) 4.9 wt % to 79.9 wt % of a solvent;
- wherein the wt % is based on a total weight of the conductive ink composition;
- wherein the conductive ink composition has a stringiness of at least 5 mm when subjected to a texture test;
- and
- wherein the texture test is conducted under the following conditions:
- immersing a probe with a diameter of 1 cm vertically into the conductive ink composition to a depth of 1 mm beneath a surface of the conductive ink composition,
- withdrawing the probe vertically at a speed of 1 mm/s, and
- defining stringiness as a maximum distance from the surface of the conductive ink composition at which a force exerted on the probe is 0 g.
8 more elements
Dependencies are inferred from the claim text.