H05K 1/097
Inks comprising nanoparticles and specially adapted for being sintered at low temperature
Official title: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)}
H05K1/097 (Inks comprising nanoparticles and specially adapted for being sintered at low temperature) appears on 653 US grants and 985 published applications in this corpus.
Search patents in H05K- Granted patents
- 653
- Published applications
- 985
- Assignees
- 424
- Inventors
- 1,868
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 0 |
| 2002 | 4 | 1 |
| 2003 | 3 | 11 |
| 2004 | 3 | 12 |
| 2005 | 2 | 21 |
| 2006 | 9 | 17 |
| 2007 | 4 | 65 |
| 2008 | 9 | 37 |
| 2009 | 18 | 50 |
| 2010 | 25 | 38 |
| 2011 | 28 | 29 |
| 2012 | 24 | 39 |
| 2013 | 20 | 34 |
| 2014 | 28 | 65 |
| 2015 | 34 | 82 |
| 2016 | 44 | 80 |
| 2017 | 49 | 62 |
| 2018 | 49 | 65 |
| 2019 | 54 | 57 |
| 2020 | 50 | 49 |
| 2021 | 42 | 51 |
| 2022 | 48 | 31 |
| 2023 | 16 | 30 |
| 2024 | 36 | 22 |
| 2025 | 15 | 26 |
| 2026 | 9 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Sintering composition21 Jul 2026US 12,686,052 B2Alpha Assembly Solutions Inc.
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Nanometric copper formulations14 Apr 2026US 12,599,965 B2P.V. Nanocell Ltd.
- Copper nano-ink, printed circuit board substrate, and method of manufacturing printed circuit board substrate10 Sep 2026US 2026/0271187 A1Sumitomo Electric Industries, Ltd.
- Formulations and processes for producing highly conductive copper patterns3 Sep 2026US 2026/0258271 A1Copprint Technologies Ltd
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Multi-color electrophoretic displays and materials for making the same695US 6,017,584 AE Ink Corporation · 2000
- Electronically addressable microencapsulated ink and display thereof597US 6,120,588 AE Ink Corporation · 2000
- Transducers and indicators having printed displays561US 6,118,426 AE Ink Corporation · 2000
- Electrophoretic displays using nanoparticles501US 6,323,989 B1E Ink Corporation · 2001
- Electro-osmotic displays and materials for making the same476US 6,120,839 AE Ink Corporation · 2000