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US 2026/0258271 A1Published application
Formulations and processes for producing highly conductive copper patterns
AssigneeCopprint Technologies Ltd
InventorMichael GROUCHKO
Life of this patent
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Abstract
This disclosure concerns formulations and processes for obtaining conductive patterns of copper onto a substrate.
Claims21
-56. (canceled)
An ink formulation comprising copper nanoparticles, at least one copper-oxidizing agent, and CuH.
A sintered printed pattern comprising copper and up to 0.1 mol % phosphorous.
A process for obtaining a pattern onto a substrate, the process comprising:
- (a) applying a dispersion or a paste that comprises copper nanoparticles in a liquid carrier onto at least a surface region of the substrate;
- (b) applying at least one copper-oxidizing agent to said substrate;
- (c) permitting at least a portion of the copper nanoparticles to react with said copper-oxidizing agent for transforming Cu0 into CuH,
- thereby obtaining a pattern of an ink.
1 more element
Dependencies are inferred from the claim text.