H05K 1/0296
Conductive pattern lay-out details not covered by sub groups h05k1/02 - h05k1/0295
Official title: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
H05K1/0296 (Conductive pattern lay-out details not covered by sub groups h05k1/02 - h05k1/0295) appears on 3,453 US grants and 4,088 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,453
- Published applications
- 4,088
- Assignees
- 1,186
- Inventors
- 7,486
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 13 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 12 | 0 |
| 1991 | 13 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 15 | 0 |
| 1995 | 12 | 0 |
| 1996 | 23 | 0 |
| 1997 | 15 | 0 |
| 1998 | 29 | 0 |
| 1999 | 27 | 0 |
| 2000 | 24 | 0 |
| 2001 | 21 | 14 |
| 2002 | 48 | 33 |
| 2003 | 39 | 50 |
| 2004 | 40 | 64 |
| 2005 | 47 | 72 |
| 2006 | 53 | 60 |
| 2007 | 56 | 76 |
| 2008 | 50 | 47 |
| 2009 | 33 | 67 |
| 2010 | 47 | 45 |
| 2011 | 41 | 53 |
| 2012 | 48 | 62 |
| 2013 | 48 | 186 |
| 2014 | 91 | 267 |
| 2015 | 191 | 342 |
| 2016 | 229 | 351 |
| 2017 | 328 | 233 |
| 2018 | 271 | 208 |
| 2019 | 278 | 216 |
| 2020 | 206 | 207 |
| 2021 | 161 | 204 |
| 2022 | 181 | 261 |
| 2023 | 169 | 275 |
| 2024 | 184 | 206 |
| 2025 | 226 | 228 |
| 2026 | 126 | 261 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,320 B2Chipbond Technology Corporation
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Electronic device and manufacturing method thereof6 Oct 2026US 12,757,323 B2Innolux Corporation
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Printed circuit board6 Oct 2026US 12,757,328 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0313790 A1Ibiden Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Electronic device1 Oct 2026US 2026/0298725 A1Kabushiki Kaisha Toyota Jidoshokki
- Battery pack1 Oct 2026US 2026/0302503 A1Honda Motor Co., Ltd.
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
Most cited
By later US patents
- Capacitance-based proximity with interference rejection apparatus and methods431US 5,565,658 ACirque Corporation · 1996
- Multilayer wiring structure283US 5,723,908 AKabushiki Kaisha Toshiba · 1998
- Flexible circuit sheet274US 9,226,689 B2Medtronic Xomed, Inc. · 2016
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- High-frequency composite part169US 5,903,421 AMurata Manufacturing Co., Ltd. · 1999