H05K 1/0298
Multilayer circuits
Official title: {Multilayer circuits}
H05K1/0298 (Multilayer circuits) appears on 2,712 US grants and 3,114 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,712
- Published applications
- 3,114
- Assignees
- 976
- Inventors
- 5,905
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 13 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 15 | 0 |
| 1995 | 12 | 0 |
| 1996 | 23 | 0 |
| 1997 | 15 | 0 |
| 1998 | 29 | 0 |
| 1999 | 27 | 0 |
| 2000 | 23 | 0 |
| 2001 | 21 | 14 |
| 2002 | 48 | 32 |
| 2003 | 38 | 50 |
| 2004 | 39 | 63 |
| 2005 | 47 | 71 |
| 2006 | 53 | 60 |
| 2007 | 54 | 72 |
| 2008 | 50 | 46 |
| 2009 | 32 | 64 |
| 2010 | 45 | 38 |
| 2011 | 38 | 47 |
| 2012 | 45 | 44 |
| 2013 | 37 | 114 |
| 2014 | 62 | 179 |
| 2015 | 124 | 242 |
| 2016 | 162 | 222 |
| 2017 | 231 | 173 |
| 2018 | 193 | 148 |
| 2019 | 200 | 165 |
| 2020 | 153 | 160 |
| 2021 | 128 | 158 |
| 2022 | 137 | 203 |
| 2023 | 131 | 202 |
| 2024 | 146 | 150 |
| 2025 | 170 | 178 |
| 2026 | 90 | 219 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Printed circuit board6 Oct 2026US 12,757,328 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Power module15 Sep 2026US 12,739,974 B2Hyundai Motor Company
- Wiring substrate8 Oct 2026US 2026/0313790 A1Ibiden Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Electronic device1 Oct 2026US 2026/0298725 A1Kabushiki Kaisha Toyota Jidoshokki
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
- Component carrier1 Oct 2026US 2026/0304608 A1AT&S (Chongqing) Company Limited
Most cited
By later US patents
- Capacitance-based proximity with interference rejection apparatus and methods431US 5,565,658 ACirque Corporation · 1996
- Multilayer wiring structure283US 5,723,908 AKabushiki Kaisha Toshiba · 1998
- Flexible circuit sheet274US 9,226,689 B2Medtronic Xomed, Inc. · 2016
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- High-frequency composite part169US 5,903,421 AMurata Manufacturing Co., Ltd. · 1999