US 2026/0304608 A1Published application

Component carrier

AssigneeAT&S (Chongqing) Company Limited

InventorsTiki ZENG, Rachel ZHOU, Raymond WANG, Fanyi CHIU

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Abstract

A component carrier including a stack includes at least one conductive layer structure and at least one insulating layer structure, wherein the at least one insulating layer structure includes a through opening that is filled with a conductive material of the at least one electrically conductive layer structure. The at least one electrically conductive layer structure is in contact with a first main surface of the at least one insulating layer structure, wherein the at least one electrically conductive layer structure includes a protruding portion at the through opening that is protruding from a surface of the at least one electrically conductive layer structure, away from the first main surface of the at least one insulating layer structure.

Claims21

Dependent claims

A component carrier (1), comprising

a stack (2) comprising at least one conductive layer structure (3) and at least
one insulating layer structure (4),
wherein the at least one insulating layer structure (4) comprises a through opening (5) that is filled with a conductive material (6) of the at least one electrically conductive layer structure (3),
wherein said at least one electrically conductive layer structure (3) is in contact with a first main surface (7) of said at least one insulating layer structure (4), and
wherein the at least one electrically conductive layer structure (3) comprises a protruding portion (8) at the through opening (5) that is protruding from a surface of the at least one electrically conductive layer structure (3), away from the first main surface (7) of said at least one insulating layer structure (4).

2 more elements

Dependencies are inferred from the claim text.