Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Eun Lee, Jung Chul Gong, Ki Hwan Kim
Life of this patent
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Abstract
A printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.
Claims24
A printed circuit board, comprising:
- a substrate with first through-portion;
- a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion;
- an electronic component having at least a portion disposed in the second through-portion;
- a first wiring pattern disposed on an upper surface of the magnetic layer;
- a second wiring pattern disposed on a lower surface of the magnetic layer;
- and
- a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.
A printed circuit board, comprising:
- a substrate having a first through-portion;
- a magnetic layer having at least a portion disposed in the first through-portion, in contact with the substrate, and having a second through-portion and a plurality of through-holes;
- a voltage regulator disposed in at least a portion of the second through-portion;
- an insulating layer covering at least a portion of each of the substrate, the magnetic layer, and the voltage regulator, and filling at least a portion of each of the second through-portion and the plurality of through-holes;
- a first wiring pattern layer disposed on an upper surface of the insulating layer;
- a second wiring pattern layer disposed on a lower surface of the insulating layer;
- and
- a plurality of via patterns penetrating each of the insulating layers in the plurality of through-holes.
A printed circuit board, comprising:
- a substrate with a first through-portion penetrating therethrough in a first direction;
- a magnetic layer comprising a magnetic material disposed in the first through-portion, the magnetic layer having a second through-portion penetrating therethrough;
- and
- an inductor disposed in the magnetic layer and around the second through-portion, the inductor comprising:
- first through-vias penetrating the magnetic layer in a pattern arranged outside the second through-portion in a second direction perpendicular to the first direction,
- a first wiring pattern disposed on an upper surface of at least the magnetic layer and contacting a top portion of at least some of the first through-vias, and
- a second wiring pattern disposed on a lower surface of at least the magnetic layer and contacting a bottom portion of at least some of the first through-vias,
- wherein the first wiring pattern is connected to the second wiring pattern by the first through-vias to form the inductor.
Dependencies are inferred from the claim text.