Circuit board
AssigneeChipbond Technology Corporation
InventorsShih-Chuan Lee, Ching-Chi Chan, Tzu-Min Wu
Life of this patent
Estimating the term…
Abstract
A circuit board includes a substrate, circuit lines and a protective layer. The circuit lines are arranged on the substrate, and each includes a first conductive section, a second conductive section and a third conductive section, the second conductive section is located between the first and third conductive sections. The first and third conductive sections are covered by the protective layer, and the second conductive portion and an outer lead of the first conductive section are not covered by the protective layer. The protective layer covering the third conductive section is provided to protect the second conductive section and the outer lead from scratch or compression.
Claims13
A circuit board comprising:
- a substrate having a surface, a first area, a second area, and a third area are defined on the surface, and the second area is located between the first and third areas in a first direction for transporting the circuit board;
- a plurality of circuit lines, each including a first conductive section arranged on the first area, a second conductive section arranged on the second area, and a third conductive section arranged on the third area, the first conductive section includes an inner lead and an outer lead, the second conductive section is located between the first and third conductive sections, and both ends of the second conductive section are connected to the outer lead of the first conductive section and the third conductive section, respectively;
- and
- a protective layer configured to cover the first and third conductive sections, wherein the second conductive section, the inner lead and the outer lead of the first conductive section are not covered by the protective layer and wherein the protective layer includes a first protective portion, at least one second protective portion, and a hollow portion located between the first protective portion and the at least one second protective portion, the first protective portion is configured to cover the first conductive section, the inner lead and the outer lead of the first conductive section are not covered by the first protective portion, the at least one second protective portion is configured to cover the third conductive section, the hollow portion is configured to expose the outer lead of the first conductive section and the second conductive section, a predetermined cutting line is configured to run through the hollow portion and be located between the first protection portion and the at least one second protective portion to separate the circuit board into a part to be reserved and a part to be removed, the outer lead is located between the first protective portion and the predetermined cutting line, the first conductive section and the first protective portion covering the first conductive section are located on the part to be reserved, the second conductive section, the third conductive section, and the at least one second protective portion covering the third conductive section are located on the part to be removed.
Dependencies are inferred from the claim text.