H05K 1/0266
Marks, test patterns or identification means
Official title: {Marks, test patterns or identification means}
H05K1/0266 (Marks, test patterns or identification means) appears on 2,448 US grants and 2,432 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,448
- Published applications
- 2,432
- Assignees
- 1,074
- Inventors
- 5,522
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 13 | 0 |
| 1985 | 11 | 0 |
| 1986 | 10 | 0 |
| 1987 | 23 | 0 |
| 1988 | 9 | 0 |
| 1989 | 15 | 0 |
| 1990 | 23 | 0 |
| 1991 | 23 | 0 |
| 1992 | 20 | 0 |
| 1993 | 28 | 0 |
| 1994 | 16 | 0 |
| 1995 | 22 | 0 |
| 1996 | 27 | 0 |
| 1997 | 25 | 0 |
| 1998 | 40 | 0 |
| 1999 | 53 | 0 |
| 2000 | 50 | 0 |
| 2001 | 67 | 42 |
| 2002 | 74 | 92 |
| 2003 | 92 | 102 |
| 2004 | 81 | 105 |
| 2005 | 71 | 135 |
| 2006 | 85 | 131 |
| 2007 | 70 | 138 |
| 2008 | 79 | 149 |
| 2009 | 80 | 146 |
| 2010 | 87 | 114 |
| 2011 | 87 | 87 |
| 2012 | 99 | 92 |
| 2013 | 87 | 71 |
| 2014 | 71 | 78 |
| 2015 | 66 | 103 |
| 2016 | 89 | 75 |
| 2017 | 80 | 86 |
| 2018 | 68 | 72 |
| 2019 | 90 | 93 |
| 2020 | 91 | 93 |
| 2021 | 78 | 84 |
| 2022 | 75 | 85 |
| 2023 | 60 | 84 |
| 2024 | 69 | 68 |
| 2025 | 70 | 63 |
| 2026 | 39 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Electronic devices25 Aug 2026US 12,720,672 B2Advanced Semiconductor Engineering, Inc.
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Electronic device including dew condensation sensor18 Aug 2026US 12,710,389 B2LG Electronics Inc.
- Wiring substrate, method of trimming same, and multi-layered wiring board4 Aug 2026US 12,701,662 B2Mitsui Kinzoku Company, Limited
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Using glass weave marker structure to authenticate printed circuit boards24 Sep 2026US 2026/0288919 A1Cisco Technology, Inc.
- Display device24 Sep 2026US 2026/0292991 A1Samsung Display Co., Ltd.
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
Most cited
By later US patents
- Method of manufacturing and testing an electronic device, and an electronic device285US 6,167,614 AMicron Technology, Inc. · 2001
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Radio frequency tag265US 5,995,006 AIntermec IP Corp. · 1999
- Semiconductor package using terminals formed on a conductive layer of a circuit board258US 6,040,622 ASanDisk Corporation · 2000
- RFID integrated in electronic assets255US 6,249,227 B1Intermec IP Corp. · 2001