H05K 1/14
Structural association of two or more printed circuits
Official title: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
H05K1/14 (Structural association of two or more printed circuits) appears on 9,481 US grants and 10,066 published applications in this corpus.
Search patents in H05K- Granted patents
- 9,481
- Published applications
- 10,066
- Assignees
- 2,689
- Inventors
- 19,609
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 8 | 0 |
| 1978 | 9 | 0 |
| 1979 | 10 | 0 |
| 1980 | 17 | 0 |
| 1981 | 14 | 0 |
| 1982 | 15 | 0 |
| 1983 | 16 | 0 |
| 1984 | 13 | 0 |
| 1985 | 29 | 0 |
| 1986 | 20 | 0 |
| 1987 | 39 | 0 |
| 1988 | 37 | 0 |
| 1989 | 48 | 0 |
| 1990 | 40 | 0 |
| 1991 | 56 | 0 |
| 1992 | 58 | 0 |
| 1993 | 59 | 0 |
| 1994 | 63 | 0 |
| 1995 | 66 | 0 |
| 1996 | 91 | 0 |
| 1997 | 83 | 0 |
| 1998 | 134 | 0 |
| 1999 | 125 | 0 |
| 2000 | 145 | 0 |
| 2001 | 162 | 90 |
| 2002 | 217 | 270 |
| 2003 | 228 | 254 |
| 2004 | 235 | 320 |
| 2005 | 225 | 315 |
| 2006 | 227 | 338 |
| 2007 | 221 | 322 |
| 2008 | 208 | 360 |
| 2009 | 235 | 391 |
| 2010 | 264 | 329 |
| 2011 | 260 | 273 |
| 2012 | 281 | 252 |
| 2013 | 232 | 277 |
| 2014 | 213 | 266 |
| 2015 | 257 | 364 |
| 2016 | 270 | 310 |
| 2017 | 358 | 401 |
| 2018 | 374 | 454 |
| 2019 | 501 | 549 |
| 2020 | 513 | 702 |
| 2021 | 531 | 615 |
| 2022 | 523 | 564 |
| 2023 | 464 | 592 |
| 2024 | 502 | 567 |
| 2025 | 506 | 439 |
| 2026 | 275 | 452 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 1/141One or more single auxiliary printed circuits mounted on a main printed3,006
- H05K 1/144Stacked arrangements of planar printed circuit boards2,469
- H05K 1/147At least one of the printed circuits being bent or folded2,410
- H05K 1/142Arrangements of planar printed circuit boards in the same plane765
- H05K 1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e.764
- H05K 1/145Arrangements wherein electric components are disposed between and simultaneously connected to two484
Recent patents
- Lens module with multi-layer bent circuit board and electronic device having the same6 Oct 2026US 12,757,330 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Electronic device6 Oct 2026US 12,757,331 B2Carux Technology Pte. Ltd.
- Power converter using a planar energy transfer element6 Oct 2026US 12,757,345 B2Power Integrations, Inc.
- LED lamp and misuse warning module thereof29 Sep 2026US 12,747,836 B2Jiaxing Super Lighting Electric Appliance Co., Ltd
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Earphone8 Oct 2026US 2026/0313283 A1Vivo Mobile Communication Co., Ltd.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Power modules with vertical power flow8 Oct 2026US 2026/0313799 A1Analog Devices International Unlimited Company
- Multipurpose coupling mechanism8 Oct 2026US 2026/0313800 A1Mellanox Technologies, Ltd.
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
Most cited
By later US patents
- Modular transaction terminal1,375US 6,065,679 AIVI Checkmate Corp. · 2000
- Optical reader comprising multiple color illumination859US 6,832,725 B2Hand Held Products, Inc. · 2004
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Three-dimensional multi-chip pad array carrier602US 5,222,014 AMotorola, Inc. · 1993
- Flexible wearable computer479US 6,108,197 AViA, Inc. · 2000