H05K 1/144
Stacked arrangements of planar printed circuit boards
Official title: {Stacked arrangements of planar printed circuit boards}
H05K1/144 (Stacked arrangements of planar printed circuit boards) appears on 2,469 US grants and 2,762 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,469
- Published applications
- 2,762
- Assignees
- 1,156
- Inventors
- 6,039
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 9 | 0 |
| 1987 | 8 | 0 |
| 1988 | 14 | 0 |
| 1989 | 11 | 0 |
| 1990 | 10 | 0 |
| 1991 | 15 | 0 |
| 1992 | 8 | 0 |
| 1993 | 18 | 0 |
| 1994 | 13 | 0 |
| 1995 | 17 | 0 |
| 1996 | 24 | 0 |
| 1997 | 25 | 0 |
| 1998 | 37 | 0 |
| 1999 | 28 | 0 |
| 2000 | 34 | 0 |
| 2001 | 35 | 27 |
| 2002 | 42 | 59 |
| 2003 | 45 | 46 |
| 2004 | 42 | 51 |
| 2005 | 43 | 60 |
| 2006 | 41 | 68 |
| 2007 | 46 | 62 |
| 2008 | 30 | 65 |
| 2009 | 39 | 81 |
| 2010 | 55 | 72 |
| 2011 | 52 | 45 |
| 2012 | 63 | 42 |
| 2013 | 46 | 61 |
| 2014 | 43 | 74 |
| 2015 | 55 | 122 |
| 2016 | 93 | 89 |
| 2017 | 92 | 125 |
| 2018 | 124 | 159 |
| 2019 | 175 | 179 |
| 2020 | 168 | 194 |
| 2021 | 157 | 173 |
| 2022 | 156 | 175 |
| 2023 | 144 | 189 |
| 2024 | 136 | 182 |
| 2025 | 147 | 140 |
| 2026 | 95 | 222 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power converter using a planar energy transfer element6 Oct 2026US 12,757,345 B2Power Integrations, Inc.
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Electronic device comprising interposer printed circuit board22 Sep 2026US 12,745,349 B2Samsung Electronics Co., Ltd.
- Electronics packaging for moving platforms8 Sep 2026US 12,733,099 B2Raytheon Company
- Reducing printed circuit board area for single-sided printed circuit board8 Sep 2026US 12,733,100 B2Solidigm Inc.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Board-to-board stacking arrangement1 Oct 2026US 2026/0304626 A1Aivres Systems Inc.
Most cited
By later US patents
- Modular transaction terminal1,375US 6,065,679 AIVI Checkmate Corp. · 2000
- Optical reader comprising multiple color illumination859US 6,832,725 B2Hand Held Products, Inc. · 2004
- Three-dimensional multi-chip pad array carrier602US 5,222,014 AMotorola, Inc. · 1993
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006