H05K 1/147
At least one of the printed circuits being bent or folded
Official title: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}
H05K1/147 (At least one of the printed circuits being bent or folded) appears on 2,410 US grants and 2,876 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,410
- Published applications
- 2,876
- Assignees
- 795
- Inventors
- 5,551
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 10 | 7 |
| 2002 | 16 | 21 |
| 2003 | 22 | 37 |
| 2004 | 22 | 57 |
| 2005 | 35 | 66 |
| 2006 | 39 | 84 |
| 2007 | 46 | 62 |
| 2008 | 52 | 95 |
| 2009 | 59 | 110 |
| 2010 | 64 | 80 |
| 2011 | 77 | 83 |
| 2012 | 82 | 70 |
| 2013 | 55 | 54 |
| 2014 | 57 | 69 |
| 2015 | 62 | 92 |
| 2016 | 54 | 102 |
| 2017 | 114 | 133 |
| 2018 | 124 | 154 |
| 2019 | 155 | 166 |
| 2020 | 179 | 287 |
| 2021 | 213 | 266 |
| 2022 | 211 | 195 |
| 2023 | 166 | 202 |
| 2024 | 199 | 143 |
| 2025 | 164 | 132 |
| 2026 | 72 | 109 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lens module with multi-layer bent circuit board and electronic device having the same6 Oct 2026US 12,757,330 B2Triple Win Technology(Shenzhen) Co. Ltd.
- LED lamp and misuse warning module thereof29 Sep 2026US 12,747,836 B2Jiaxing Super Lighting Electric Appliance Co., Ltd
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Camera module comprising circuit board with lateral connecting belts22 Sep 2026US 12,744,982 B2Ningbo Sunny Opotech Co., Ltd.
- Display device comprising flexible substrate with plurality of pixels having improved heat dissipation characteristic22 Sep 2026US 12,745,553 B2Samsung Display Co., Ltd.
- Earphone8 Oct 2026US 2026/0313283 A1Vivo Mobile Communication Co., Ltd.
- Board assembly, board, and electronic device1 Oct 2026US 2026/0304624 A1Wacom Co., Ltd.
- Component carrier, method for manufacturing a component carrier and component carrier assembly1 Oct 2026US 2026/0304627 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electronic device17 Sep 2026US 2026/0280098 A1Huawei Technologies Co., Ltd.
- Flexible circuit board and electronic device10 Sep 2026US 2026/0271179 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Robotic surgical system with local sensing of functional parameters based on measurements of multiple physical inputs249US 11,376,082 B2Cilag GmbH International · 2022
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Instrument drive units235US 10,736,219 B2Covidien LP · 2020
- Low profile multi-IC chip package connector218US 6,258,623 B1Micron Technology, Inc. · 2001
- Low profile multi-IC chip package connector181US 6,225,689 B1Micron Technology, Inc. · 2001