H05K 1/145
Arrangements wherein electric components are disposed between and simultaneously connected to two
Official title: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules}
H05K1/145 (Arrangements wherein electric components are disposed between and simultaneously connected to two) appears on 484 US grants and 521 published applications in this corpus.
Search patents in H05K- Granted patents
- 484
- Published applications
- 521
- Assignees
- 301
- Inventors
- 1,202
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 3 |
| 2002 | 12 | 14 |
| 2003 | 9 | 10 |
| 2004 | 11 | 17 |
| 2005 | 13 | 21 |
| 2006 | 16 | 15 |
| 2007 | 12 | 12 |
| 2008 | 12 | 15 |
| 2009 | 6 | 13 |
| 2010 | 10 | 13 |
| 2011 | 5 | 5 |
| 2012 | 10 | 8 |
| 2013 | 8 | 11 |
| 2014 | 7 | 10 |
| 2015 | 7 | 10 |
| 2016 | 8 | 12 |
| 2017 | 18 | 16 |
| 2018 | 23 | 22 |
| 2019 | 23 | 24 |
| 2020 | 18 | 29 |
| 2021 | 24 | 38 |
| 2022 | 28 | 22 |
| 2023 | 23 | 39 |
| 2024 | 23 | 77 |
| 2025 | 66 | 37 |
| 2026 | 32 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device comprising interposer printed circuit board22 Sep 2026US 12,745,349 B2Samsung Electronics Co., Ltd.
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- Reducing printed circuit board area for single-sided printed circuit board8 Sep 2026US 12,733,100 B2Solidigm Inc.
- Semiconductor device, semiconductor module, power conversion unit, and method for manufacturing semiconductor device17 Sep 2026US 2026/0280165 A1Rohm Co., Ltd.
- Semiconductor device10 Sep 2026US 2026/0271192 A1Fuji Electric Co., Ltd.
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
- Multiphase system comprising power converter27 Aug 2026US 2026/0254352 A1Mitsubishi Electric Corporation
- Electronic device20 Aug 2026US 2026/0247533 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Integrated circuit chip stacking322US 4,956,694 ADense-Pac Microsystems, Inc. · 1990
- Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device234US 6,740,964 B2Oki Electric Industry Co., Ltd. · 2004