Semiconductor device

A semiconductor device, comprising:

• first to fourth semiconductor chips;
• a first conductive plate electrically connected to a bottom surface of the first semiconductor chip;
• a second conductive plate electrically connected to a bottom surface of the second semiconductor chip;
• a third conductive plate electrically connected to a bottom surface of each of the third and fourth semiconductor chips;
• a first external terminal connected to the first conductive plate;
• a second external terminal electrically connected to a top surface of the second semiconductor chip;
• a third external terminal electrically connected to a top surface of the third semiconductor chip;
• and
• a fourth external terminal electrically connected to a top surface of each of the first and fourth semiconductor chips, wherein
• the first to third external terminals are disposed to be opposite to the fourth external terminal across the first to fourth semiconductor chips, and
• the first and second semiconductor chips are provided closer to the first and second external terminals than the third and fourth semiconductor chips.