H05K 1/141
One or more single auxiliary printed circuits mounted on a main printed
Official title: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
H05K1/141 (One or more single auxiliary printed circuits mounted on a main printed) appears on 3,006 US grants and 2,984 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,006
- Published applications
- 2,984
- Assignees
- 1,082
- Inventors
- 6,793
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 9 | 0 |
| 1987 | 15 | 0 |
| 1988 | 11 | 0 |
| 1989 | 21 | 0 |
| 1990 | 15 | 0 |
| 1991 | 24 | 0 |
| 1992 | 32 | 0 |
| 1993 | 25 | 0 |
| 1994 | 27 | 0 |
| 1995 | 25 | 0 |
| 1996 | 40 | 0 |
| 1997 | 36 | 0 |
| 1998 | 62 | 0 |
| 1999 | 59 | 0 |
| 2000 | 67 | 0 |
| 2001 | 77 | 44 |
| 2002 | 108 | 128 |
| 2003 | 115 | 141 |
| 2004 | 126 | 153 |
| 2005 | 114 | 132 |
| 2006 | 101 | 154 |
| 2007 | 100 | 141 |
| 2008 | 91 | 140 |
| 2009 | 93 | 138 |
| 2010 | 111 | 129 |
| 2011 | 95 | 110 |
| 2012 | 100 | 86 |
| 2013 | 86 | 100 |
| 2014 | 68 | 87 |
| 2015 | 85 | 91 |
| 2016 | 83 | 74 |
| 2017 | 93 | 83 |
| 2018 | 84 | 73 |
| 2019 | 99 | 127 |
| 2020 | 100 | 122 |
| 2021 | 97 | 120 |
| 2022 | 110 | 136 |
| 2023 | 90 | 146 |
| 2024 | 118 | 117 |
| 2025 | 106 | 109 |
| 2026 | 52 | 103 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module15 Sep 2026US 12,739,974 B2Hyundai Motor Company
- Reducing printed circuit board area for single-sided printed circuit board8 Sep 2026US 12,733,100 B2Solidigm Inc.
- Electronic devices and electronic device systems1 Sep 2026US 12,727,095 B2Samsung Electronics Co., Ltd.
- Back side power delivery for wafer-scale integration with solderless modular power substrates25 Aug 2026US 12,721,191 B2Volantis Semiconductor, Inc.
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Multipurpose coupling mechanism8 Oct 2026US 2026/0313800 A1Mellanox Technologies, Ltd.
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Phase shifter assembly1 Oct 2026US 2026/0304625 A1Suzhou Luxshare Technology Co., Ltd.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998