Back side power delivery for wafer-scale integration with solderless modular power substrates

An apparatus for power delivery comprising:

• a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the WSSI includes a plurality of through-silicon vias (TSVs);
• a plurality of modular power substrates (MPSs), wherein the plurality of MPSs is attached to a back side of the WSSI by a plurality of compression connectors;
• and
• a unified control board (UCB), wherein the UCB is mechanically connected to the plurality of MPSs, wherein the UCB comprises a compression plate for the plurality of compression connectors, wherein the UCB includes a plurality of DC-to-DC converters, wherein the UCB sends DC power to the plurality of functional chips bonded to the WSSI, and wherein the sending is based on the plurality of MPSs and the plurality of TSVs.

A system for power delivery comprising:

• a wafer-scale silicon interposer (WSSI), wherein a front side of the WSSI is bonded to a plurality of functional chips, wherein the WSSI includes a plurality of through-silicon vias (TSVs);
• a plurality of modular power substrates (MPSs), wherein the plurality of MPSs is attached to a back side of the WSSI by a plurality of compression connectors;
• and
• a unified circuit board (UCB), wherein the UCB is mechanically connected to the plurality of MPSs, wherein the UCB includes a plurality of DC-to-DC converters, and wherein the UCB comprises a compression plate for the plurality of compression connectors, wherein the system, when provided DC power, is configured to:
• send DC power to the plurality of functional chips bonded to the WSSI, wherein the sending is based on the plurality of DC-to-DC converters, the plurality of MPSs, and the plurality of TSVs.