H05K 1/0284
Details of three-dimensional rigid printed circuit boards
Official title: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)}
H05K1/0284 (Details of three-dimensional rigid printed circuit boards) appears on 809 US grants and 814 published applications in this corpus.
Search patents in H05K- Granted patents
- 809
- Published applications
- 814
- Assignees
- 524
- Inventors
- 2,140
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 10 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 13 | 0 |
| 1991 | 16 | 0 |
| 1992 | 11 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 10 | 0 |
| 1996 | 8 | 0 |
| 1997 | 11 | 0 |
| 1998 | 18 | 0 |
| 1999 | 13 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 5 |
| 2002 | 10 | 19 |
| 2003 | 8 | 11 |
| 2004 | 16 | 17 |
| 2005 | 8 | 19 |
| 2006 | 11 | 23 |
| 2007 | 15 | 22 |
| 2008 | 11 | 33 |
| 2009 | 14 | 32 |
| 2010 | 18 | 25 |
| 2011 | 19 | 16 |
| 2012 | 14 | 22 |
| 2013 | 13 | 23 |
| 2014 | 18 | 41 |
| 2015 | 24 | 72 |
| 2016 | 47 | 56 |
| 2017 | 43 | 39 |
| 2018 | 38 | 48 |
| 2019 | 61 | 54 |
| 2020 | 49 | 53 |
| 2021 | 34 | 42 |
| 2022 | 40 | 36 |
| 2023 | 37 | 32 |
| 2024 | 35 | 37 |
| 2025 | 22 | 22 |
| 2026 | 22 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Image pickup unit and endoscope22 Sep 2026US 12,745,347 B2Olympus Medical Systems Corp.
- Circuit board and manufacturing method thereof8 Sep 2026US 12,733,112 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Wiring substrate and electronic device23 Jun 2026US 12,666,533 B2Boe Technology Group Co., Ltd.
- Circuit board and semiconductor package comprising same1 Oct 2026US 2026/0304606 A1LG Innotek Co., Ltd.
- Channel element, package, drug delivery device, biomolecule testing apparatus, and channel forming method24 Sep 2026US 2026/0284655 A1Okinawa Institute of Science and Technology School Corporation
- Circuit module and optical device24 Sep 2026US 2026/0292988 A1Canon Kabushiki Kaisha
- Electronic device17 Sep 2026US 2026/0280098 A1Huawei Technologies Co., Ltd.
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Substrate for packaging a semiconductor device having particular terminal and bump structure229US 5,196,726 ASumitomo Electric Industries, Ltd. · 1993