Circuit board and semiconductor package comprising same

Abstract

An embodiment of the present invention provides a circuit board comprising: a core layer comprising a cavity; and a connection member disposed in the cavity of the core layer. The cavity's side surface comprises multiple side surfaces facing multiple side surfaces of the connection member. Each of the multiple side surfaces of the cavity includes a first portion spaced apart from the connection member in the horizontal direction by a predetermined distance along the circumference of the connection member, and a second portion disposed closer to the connection member than the first portion. The second portions of the multiple side surfaces of the cavity overlap the connection member along the horizontal direction.

Dependencies are inferred from the claim text.