Wiring substrate and electronic device

An electronic device, comprising:

• a wiring substrate and an electronic element;
• wherein
• the wiring substrate comprises:
• a base substrate;
• a plurality of constant voltage signal lines and a plurality of first connection lines that are disposed on a same side of the base substrate;
• a plurality of first pad regions, wherein each of the first pad regions comprises a plurality of sub-regions arranged in parallel, each of the sub-regions comprising a plurality of pad groups arranged in series, the plurality of pad groups arranged in series comprising at least a first pad group and a last pad group, an orthographic projection of either the first pad group or the last pad group on the base substrate being partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate, an orthographic projection of other of the first pad group or the last pad group on the base substrate being partially overlapped with an orthographic projection of one of the first connection lines on the base substrate;
• and
• the electronic element is connected to the first pad region.