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US 12,753,301 B2Granted
Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsRihoko Watanabe, Hirosuke Saito, Hiroaki Umehara, Hiroharu Inoue
Life of this patent
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Abstract
A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
Claims18
A resin composition comprising:
- a maleimide compound (A) having an arylene structure bonded in meta-orientation in a molecule;
- and
- a styrenic polymer being solid at 25° C.,
- wherein the weight average molecular weight of the styrenic polymer is 54,000 to 92,000.
1 more element
Dependencies are inferred from the claim text.