H05K 1/03
Use of materials for the substrate
H05K1/03 (Use of materials for the substrate) appears on 13,334 US grants and 13,340 published applications in this corpus.
Search patents in H05K- Granted patents
- 13,334
- Published applications
- 13,340
- Assignees
- 3,503
- Inventors
- 25,766
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 49 | 0 |
| 1977 | 43 | 0 |
| 1978 | 50 | 0 |
| 1979 | 21 | 0 |
| 1980 | 45 | 0 |
| 1981 | 62 | 0 |
| 1982 | 88 | 0 |
| 1983 | 77 | 0 |
| 1984 | 83 | 0 |
| 1985 | 118 | 0 |
| 1986 | 115 | 0 |
| 1987 | 153 | 0 |
| 1988 | 176 | 0 |
| 1989 | 225 | 0 |
| 1990 | 230 | 0 |
| 1991 | 227 | 0 |
| 1992 | 263 | 0 |
| 1993 | 245 | 0 |
| 1994 | 234 | 0 |
| 1995 | 202 | 0 |
| 1996 | 182 | 0 |
| 1997 | 209 | 0 |
| 1998 | 239 | 0 |
| 1999 | 247 | 0 |
| 2000 | 187 | 0 |
| 2001 | 286 | 102 |
| 2002 | 309 | 375 |
| 2003 | 310 | 398 |
| 2004 | 322 | 445 |
| 2005 | 249 | 500 |
| 2006 | 273 | 525 |
| 2007 | 267 | 542 |
| 2008 | 268 | 524 |
| 2009 | 269 | 653 |
| 2010 | 345 | 579 |
| 2011 | 344 | 439 |
| 2012 | 396 | 395 |
| 2013 | 329 | 462 |
| 2014 | 319 | 549 |
| 2015 | 385 | 673 |
| 2016 | 489 | 577 |
| 2017 | 504 | 555 |
| 2018 | 472 | 600 |
| 2019 | 569 | 562 |
| 2020 | 515 | 622 |
| 2021 | 445 | 589 |
| 2022 | 407 | 536 |
| 2023 | 402 | 550 |
| 2024 | 427 | 574 |
| 2025 | 399 | 512 |
| 2026 | 264 | 502 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board6 Oct 2026US 12,753,301 B2Panasonic Intellectual Property Management Co., Ltd.
- Modified resin composition, preparation method therefor and use thereof6 Oct 2026US 12,753,303 B2Guangdong Hinno-Tech Co., Ltd.
- Organic substrate for placing components of a camera6 Oct 2026US 12,756,912 B1Apple Inc.
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Resin composition, film, metal-clad laminate, and circuit board8 Oct 2026US 2026/0308452 A1Kuraray Co., Ltd.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
- Flexible and stretchable structures8 Oct 2026US 2026/0313807 A1Liquid Wire Inc.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- Transferred flexible integrated circuit464US 6,027,958 AKopin Corporation · 2000
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002